LDA201
I
NTEGRATED
C
IRCUITS
D
IVISION
Parameter
Breakdown Voltage - BV
CEO
Current Transfer Ratio - CTR (Typ)
Saturation Voltage - V
CE(sat)
Input Control Current - I
F
Rating
30
300
0.5
1
Units
V
P
%
V
mA
Dual Optocouplers, Unidirectional Input
Single-Transistor Output
Description
LDA201 is a dual optocoupler with unidirectional
inputs and single-transistor outputs. Current transfer
ratios range from 33% to 1000% with a typical value
of 300%.
Features
•
•
•
•
•
•
100mA Continuous Load Rating
3750V
rms
Input/Output Isolation
Unidirectional Input
Small 8-Pin Package
Flammability Rating UL 94 V-0
DIP Versions - Machine Insertable,
Wave Solderable
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Applications
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
Part Number
LDA201
LDA201S
LDA201STR
Description
8-Pin DIP (50/tube)
8-Pin Surface Mount (50/tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
1
A
K
K
A
4
5
2
3
8
7
6
C
E
E
C
DS-LDA201-R06
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IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Power Dissipation
Input
1
Phototransistor
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
LDA201
Ratings
30
5
100
1
150
150
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
ºC
ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 1.33mW / ºC
Derate linearly 2mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Phototransistor Breakdown Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Reverse Input Current
Common Characteristics
Capacitance, Input to Output
Conditions
I
C
= 10A
V
CEO
= 5V, I
F
= 0mA
I
C
= 2mA, I
F
= 1mA
I
F
= 1mA, V
CE
= 0.5V
25V, f =1MHz
I
C
= 0.33mA, V
CE
= 0.5V
I
F
= 5mA
V
R
= 5V
-
Symbol
BV
CEO
I
CEO
V
CE(sat)
CTR
C
OUT
I
F
V
F
I
R
C
IO
Min
30
-
-
33
-
-
0.9
-
-
Typ
85
10
0.3
300
6
-
1.2
-
3
Max
-
500
0.5
1000
-
1
1.4
10
-
Units
V
nA
V
%
pF
mA
V
A
pF
Switching Characteristics @ 25ºC
Characteristic
Turn-On Time
Turn-Off Time
Symbol
t
on
t
off
Test Condition
V
CC
=5V, I
F
=2mA, R
L
=1K
Typ
7
20
Units
s
Switching Time Test Circuit
V
CC
I
F
R
L
V
CE
I
F
V
CE
90%
10%
t
on
t
off
Pulse Width=5ms
Duty Cycle=1%
2
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PERFORMANCE DATA*
LED Voltage vs. Current (Linear)
50
LED Forward Current (mA)
40
30
20
10
0
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
100
LED Forward Current (mA)
LED Forward Voltage (V)
LDA201
LED Voltage vs. Current (Log)
1.6
1.5
1.4
1.3
1.2
1.1
LED Forward Voltage vs. Temperature
I
F
=50mA
I
F
=20mA
I
F
=10mA
10
1
0.1
1.0
1.1
1.2
1.3
1.4
1.5
LED Forward Voltage (V)
1.6
1.0
-40
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
Temperature (ºC)
80
100
700
Current Transfer Ratio (%)
600
500
400
300
200
100
Typical CTR vs. LED Forward Current
(V
CE
=5V)
-40ºC
25ºC
55ºC
85ºC
Typical Collector Current vs.
Collector Voltage
100
Collector Current (mA)
80
I
F
=20mA
60
I
F
=10mA
40
20
0
I
F
=5mA
I
F
=2mA
I
F
=1mA
0
1
2
3
4
Collector Voltage (V)
5
6
I
F
=50mA
100
80
I
CE
Current vs. Temperature
(V
CE
=5V)
I
CE
Current (mA)
I
F
=20mA
60
40
20
0
-40
I
F
=15mA
I
F
=10mA
I
F
=5mA
I
F
=2mA
I
F
=1mA
-20
0
20
40
60
80
Temperature (ºC)
100
120
0
10
20
30
40
50
LED Forward Current (mA)
60
0.20
Saturation Voltage (V)
0.18
0.16
0.14
0.12
0.10
Saturation Voltage vs. Temperature
(I
F
=2mA, I
C
=1mA)
Blocking Voltage (V
P
)
Blocking Voltage vs. Temperature
96
Leakage Current (nA)
95
94
93
92
91
90
89
88
87
500
400
300
200
100
0
-40
Collector Leakage Current
vs. Temperature
V
CE
=10V
V
CE
=5V
V
CE
=3V
0.08
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
14
12
Turn-On Time ( s)
10
8
6
4
2
Turn-On Time vs. Load Resistance
(V
CC
=5V)
10
Turn-Off Time (ms)
I
F
=1mA
8
6
4
2
0
1k
10k
100k
Load Resistance ( )
1M
0
Turn-Off Time vs. Load Resistance
(V
CC
=5V)
I
F
=2mA
I
F
=5mA
I
F
=1mA
I
F
=2mA
I
F
=5mA
0
100
100
200
300
400
Load Resistance (k )
500
600
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
R06
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Manufacturing Information
Moisture Sensitivity
LDA201
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LDA201 / LDA201S
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of
J-STD-020
must be observed.
Device
LDA201 / LDA201S
Classification Temperature (T
c
)
250ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4
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Mechanical Dimensions
LDA201
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
LDA201
PCB Hole Pattern
8-0.800 DIA.
(8-0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
2.540 ± 0.127
(0.100 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
LDA201S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
1.65
(0.0649)
8.90
(0.3503)
0.457 ± 0.076
(0.018 ± 0.003)
4.445 ± 0.127
(0.175 ± 0.005)
0.65
(0.0255)
0.813 ± 0.102
(0.032 ± 0.004)
Dimensions
mm
(inches)
R06
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