Single Positive-Edge-Triggered D-Type Flip-Flop 5-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | DSBGA-5 |
| 针数 | 5 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Single Positive-Edge-Triggered D-Type Flip-Fl |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B5 |
| JESD-609代码 | e1 |
| 长度 | 1.4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 160000000 Hz |
| 最大I（ol） | 0.032 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA5,2X3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 9.9 ns |
| 传播延迟（tpd） | 9.9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 0.9 mm |
| 最小 fmax | 160 MHz |
| SN74LVC1G80YZPR | SN74LVC1G80DCKT | SN74LVC1G80DCKRG4 | SN74LVC1G80DCKRE4 | SN74LVC1G80DBVTG4 | SN74LVC1G80DBVRG4 | SN74LVC1G80DBVT | SN74LVC1G80DBVRE4 | SN74LVC1G80YEPR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-DSBGA -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SC70 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SC70 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SC70 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SOT-23 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SOT-23 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SOT-23 -40 to 125 | Single Positive-Edge-Triggered D-Type Flip-Flop 5-SOT-23 -40 to 125 | IC FF D-TYPE SNGL 1BIT 5DSBGA |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | BGA | SOIC | TSSOT | SOIC | SOT-23 | SOT-23 | SOT-23 | SOIC | BGA |
| 包装说明 | DSBGA-5 | TSSOP, TSSOP5/6,.08 | TSSOP, TSSOP5/6,.08 | TSSOP, TSSOP5/6,.08 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | VFBGA, BGA5,2X3,20 |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | not_compliant |
| Factory Lead Time | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 1 week | 6 weeks | 1 week |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | R-XBGA-B5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-XBGA-B5 |
| JESD-609代码 | e1 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e0 |
| 长度 | 1.4 mm | 2 mm | 2 mm | 2 mm | 2.9 mm | 2.9 mm | 2.9 mm | 2.9 mm | 1.4 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大I（ol） | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.024 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VFBGA | TSSOP | TSSOP | TSSOP | LSSOP | LSSOP | LSSOP | LSSOP | VFBGA |
| 封装等效代码 | BGA5,2X3,20 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSSOP5/6,.08 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | BGA5,2X3,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR | TR | TR | TR | TR | TR | TR | TR | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 传播延迟（tpd） | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.5 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.45 mm | 1.45 mm | 1.45 mm | 1.45 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm | 0.5 mm |
| 端子位置 | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 0.9 mm | 1.25 mm | 1.25 mm | 1.25 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 0.9 mm |
| 最小 fmax | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| 最大频率@ Nom-Su | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | 160000000 Hz | - |
| 最大电源电流（ICC） | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - |
| Prop。Delay @ Nom-Su | 9.9 ns | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns | - |
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