IC HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, Bus Driver/Transceiver
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 6 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 传播延迟（tpd） | 30 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 5.3 mm |
| Base Number Matches | 1 |
| 74HC366DB-T | 74HC366NB | 74HC366DB | 74HCT366NB | |
|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, Bus Driver/Transceiver | HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16 | IC HC/UH SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, Bus Driver/Transceiver | HCT SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDIP16 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 其他特性 | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE |
| 系列 | HC/UH | HC/UH | HC/UH | HCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
| 长度 | 6.2 mm | 19.025 mm | 6.2 mm | 19.025 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 6 | 6 | 6 | 6 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DIP | SSOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE |
| 传播延迟（tpd） | 30 ns | 30 ns | 30 ns | 36 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 4.2 mm | 2 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 2.54 mm | 0.65 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 5.3 mm | 7.62 mm | 5.3 mm | 7.62 mm |
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