Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-32
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| Reach Compliance Code | compli |
| 地址总线宽度 | 3 |
| 边界扫描 | NO |
| 最大时钟频率 | 50 MHz |
| 通信协议 | ASYNC, BIT |
| 数据编码/解码方法 | NRZ |
| 最大数据传输速率 | 0.390625 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-XQCC-N32 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 2 |
| 串行 I/O 数 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.25 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
XR16L580芯片的省电模式主要通过两种方式来实现：睡眠模式（Sleep Mode）和节能模式（Power-Save Mode）。
睡眠模式（Sleep Mode）：
节能模式（Power-Save Mode）：
通过这两种模式的结合使用，XR16L580芯片能够在不活跃时显著降低功耗，从而延长电池寿命或减少能源消耗。
| XR16L580ILTR-F | XR16L580IL-F | XR16L580IMTR-F | XR16L580IL24-F | XR16L580IL28-F | XR16L580IL24 | |
|---|---|---|---|---|---|---|
| 描述 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-32 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-32 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, GREEN, TQFP-48 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 4 X 4 MM, 0.90 MM HEIGHT, GREEN, QFN-24 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-28 | Serial I/O Controller, 1 Channel(s), 0.390625MBps, CMOS, 4 X 4 MM, 0.90 MM HEIGHT, QFN-24 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | QFN | QFN | QFP | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | TFQFP, TQFP48,.35SQ | HVQCCN, LCC24,.16SQ,20 | 5 X 5 MM, 0.90 MM HEIGHT, GREEN, QFN-28 | VQCCN, LCC24,.16SQ,20 |
| 针数 | 32 | 32 | 48 | 24 | 28 | 24 |
| Reach Compliance Code | compli | compli | compli | compli | unknow | compli |
| 地址总线宽度 | 3 | 3 | 3 | 3 | 3 | 3 |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| 数据编码/解码方法 | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ |
| 最大数据传输速率 | 0.390625 MBps | 0.390625 MBps | 0.390625 MBps | 0.390625 MBps | 0.390625 MBps | 0.390625 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-XQCC-N32 | S-XQCC-N32 | S-PQFP-G48 | S-XQCC-N24 | S-XQCC-N28 | S-XQCC-N24 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e0 |
| 长度 | 5 mm | 5 mm | 7 mm | 4 mm | 5 mm | 4 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 2 | 3 | 3 | 3 | 2 | 1 |
| 串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 48 | 24 | 28 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | TFQFP | HVQCCN | VQCCN | VQCCN |
| 封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | TQFP48,.35SQ | LCC24,.16SQ,20 | LCC28,.2SQ,20 | LCC24,.16SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 240 |
| 电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1.2 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V | 2.25 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | NOT SPECIFIED |
| 宽度 | 5 mm | 5 mm | 7 mm | 4 mm | 5 mm | 4 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
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