CMS15
TOSHIBA Schottky Barrier Diode
CMS15
Switching Mode Power Supply Applications
(Output voltage:
≤12
V)
DC/DC Converter Applications
•
•
•
•
Forward voltage: V
FM
= 0.58 V (max)
Average forward current: I
F (AV)
= 3.0 A
Repetitive peak reverse voltage: V
RRM
= 60 V
Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak surge current
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
60
3.0 (Note 1)
60 (50Hz)
−40~150
−40~150
Unit
V
A
A
°C
°C
Note 1: Tℓ
=
95°C
Device mounted on a ceramic board
Board size: 50 mm
×
50 mm
Soldering size: 2 mm
×
2 mm
Board thickness: 0.64 t
Rectangular waveform (α
=
180°), V
R
=
30 V
JEDEC
JEITA
―
―
Note 2: Using continuously under heavy loads (e.g. the application of
TOSHIBA
3-4E1A
high temperature/current/voltage and the significant change in
Weight: 0.023 g (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Peak forward voltage
Symbol
V
FM (1)
V
FM (2)
V
FM (3)
Peak repetitive reverse current
Junction capacitance
I
RRM (1)
I
RRM (2)
C
j
Test Condition
I
FM
=
1.0 A (pulse test)
I
FM
=
2.0 A (pulse test)
I
FM
=
3.0 A (pulse test)
V
RRM
=
5 V (pulse test)
V
RRM
=
60 V (pulse test)
V
R
=
10 V, f
=
1.0 MHz
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.43
0.49
0.55
1.0
25
102
⎯
Max
⎯
⎯
0.58
⎯
300
⎯
60
μA
pF
V
Unit
⎯
⎯
135
°C/W
⎯
⎯
210
⎯
⎯
16
°C/W
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2006-11-13
CMS15
Marking
Abbreviation Code
SE
Part No.
CMS15
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
1)
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating method½ that we
recommend when you design a circuit with a device.
V
RRM
: Use this rating with reference to (1) above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
I
F (AV)
: We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of
I
F (AV)
and T
j
be below 120°C. When using this device, take a margin into consideration by using
an allowable Tamax-I
F (AV)
curve.
I
FSM
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal
operation, which seldom occurs during the lifespan of the device.
T
j
: Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at a T
j
of below 120°C.
3)
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
Please refer to the Rectifiers databook for further information.
2)
4)
2.1
2
2006-11-13
CMS15
i
F
– v
F
100
P
F (AV)
– I
F (AV)
2.4
DC
i
F
(A)
Average forward power dissipation
P
F (AV)
(W)
50
30
10
5
3
1
Pulse test
Instantaneous forward current
Tj
=
150°C
2.0
120°
1.6
α =
60°
1.2
180°
125°C
25°C
0.5
0.3 75°C
0.1
0.05
0.03
0.01
0.0
Rectangular
waveform
0.8
0°
α
360°
Conduction angle
α
0.4
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.0
0.0
0.8
1.6
2.4
3.2
4.0
Instantaneous forward voltage vF
(V)
Average forward current
I
F (AV)
(A)
Tℓ max – I
F (AV)
160
160
140
Ta max – I
F (AV)
Device mounted on a ceramic board: Rectangular
board size: 50 mm
×
50 mm waveform
soldering land:
2 mm
×
2 mm
board thickness:
0°
α
360°
0.64 t
IF (AV)
Conduction
angle
α
VR
=
30 V
180°
Maximum allowable lead temperature
T
ℓ
max (°C)
140
120
100
α =
60°
80
60
40
0°
α
360°
Rectangular
waveform
120°
180°
DC
Maximum allowable temperature
Ta max (°C)
120
100
80
60
120°
40
20
α =
60°
0
0
DC
IF (AV)
20 Conduction
angle
α
VR
=
30 V
0
0 0.4 0.8 1.2 1.6
2.0 2.4 2.8 3.2
3.6 4.0 4.4
0.4 0.8 1.2
1.6 2.0
2.4 2.8 3.2
3.6 4.0 4.4
Average forward current
I
F (AV)
(A)
Average forward current
I
F (AV)
(A)
r
th (j-a)
– t
1000
500
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 2.1 mm
×
1.4 mm
board thickness: 1.6 t
Transient thermal impedance
rth (j-a) (°C/W)
300
100
50
30
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 6.0 mm
×
6.0 mm
board thickness: 1.6 t
Device mounted on a ceramic board:
board size: 50 mm
×
50 mm
Soldering land: 2.0 mm
×
2.0 mm
board thickness: 0.64 t
0.003
0.01
0.03
0.1
0.3
1
3
10
30
100
300
1000
10
5
3
1
0.001
Time t (s)
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2006-11-13
CMS15
Surge forward current
C
j
– V
R
1000
500
(typ.)
80
(non-repetitive)
I
FSM
(A)
Ta
=
25°C
f
=
50 Hz
60
Ta
=
25°C
f
=
1 MHz
C
j
(pF)
100
50
Peak surge forward current
3
5
10
30
50
100
Junction capacitance
40
10
5
20
1
1
Reverse voltage
VR
(V)
0
1
3
5
10
30
50
100
Number of cycles
I
R
– T
j
100
Pulse test
(typ.)
0.6
Rectangular
waveform
0°
360°
P
R (AV)
– V
R
(typ.)
Average reverse power dissipation
P
R (AV)
(W)
(mA)
10
0.5
I
R
1
48 V
0.1
30 V
0.01
20 V
10 V
0.001
VR
=
5 V
40 V
0.4
VR
α
300°
240°
180°
120°
DC
Reverse current
0.3
Conduction angle
α
Tj
=
125°C
0.2
0.1
α =
60°
6
12
18
24
30
36
42
48
0.0001
0
20
40
60
80
100
120
140
160
0.0
0
Junction temperature Tj
(°C)
Reverse voltage
VR
(V)
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2006-11-13
CMS15
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-13
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