CMS17
TOSHIBA Schottky Barrier Diode
CMS17
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
•
•
•
•
Forward voltage: V
FM
= 0.48 V (max)
Average forward current: I
F (AV)
= 2.0 A
Repetitive peak reverse voltage: V
RRM
= 30 V
Suitable for compact assembly due to a small surface-mount package:
“M−FLAT
TM
” (Toshiba package name)”
Unit: mm
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic
Repetitive peak reverse voltage
Average forward current
Nonrepetitive peak surge current
Junction temperature
Storage temperature range
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
30
2.0 (Note 1)
30 (50 Hz)
−40~150
−40~150
Unit
V
A
A
°C
°C
Note 1: Ta
=
77°C
Device mounted on a ceramic board
Board size: 50 mm
×
50 mm
Soldering size: 2 mm
×
2 mm
Board thickness: 0.64 t
Rectangular waveform (α
=
180°), V
R
=
15 V
JEDEC
JEITA
TOSHIBA
⎯
⎯
3-4E1A
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristic
Peak forward voltage
Symbol
V
FM (1)
V
FM (2)
I
RRM (1)
I
RRM (2)
C
j
Test Condition
I
FM
=
1.0 A (pulse test)
I
FM
=
2.0 A (pulse test)
V
RRM
=
5 V (pulse test)
V
RRM
=
30 V (pulse test)
V
R
=
10 V, f
=
1.0 MHz
Device mounted on a ceramic board
(board size: 50 mm
×
50 mm)
(soldering land: 2 mm
×
2 mm)
(board thickness: 0.64 t)
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 6 mm
×
6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy board
(board size: 50 mm
×
50 mm)
(soldering land: 2.1 mm
×
1.4 mm)
(board thickness: 1.6 t)
Thermal resistance
(junction to lead)
R
th (j-ℓ)
⎯
Min
⎯
⎯
⎯
⎯
⎯
⎯
Typ.
0.42
0.45
0.8
10
90
⎯
Max
⎯
0.48
⎯
100
⎯
60
Unit
V
Peak repetitive reverse current
Junction capacitance
μA
pF
⎯
⎯
135
°C/W
⎯
⎯
210
⎯
⎯
16
°C/W
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2006-11-13
CMS17
Marking
Abbreviation Code
SG
Part No.
CMS17
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
1)
Schottky barrier diodes have reverse current characteristics compared to other diodes. SBDs can cause thermal
runaway when used under high temperature or high voltage conditions. Be sure to take forward and reverse
loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values that must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit incorporating this device.
V
RRM
: Use this rating with reference to (1) above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account when designing a device for operation at low
temperature.
I
F (AV)
: We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of
I
F (AV)
and that T
j
be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-I
F (AV)
curve.
I
FSM
: This rating specifies the nonrepetitive peak current. This is applied only for abnormal operation,
which seldom occurs during the lifespan of the device.
T
j
:
Derate this rating when using the device to ensure high reliability.
We recommend that the device be used at a T
j
of below 120°C.
2)
3)
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the
device. When using the device, design the circuit board and soldering land size to match the appropriate
thermal resistance value.
Refer to the Rectifiers databook for further information.
4)
2.1
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2006-11-13
CMS17
i
F
– v
F
10
Pulse test
1.2
P
F (AV)
– I
F (AV)
DC
i
F
(A)
Average forward power dissipation
P
F (AV)
(W)
3
Tj
=
150°C
1
125°C
75°C
0.3
25°C
1.0
180°
120°
Instantaneous forward current
0.8
0.6
α =
60°
Rectangular
waveform
0.1
0.4
0.03
0.2
0°
α
360°
Conduction angle
α
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Instantaneous forward voltage
v
F
(V)
Average forward current
I
F (AV)
(A)
Ta max – I
F (AV)
160
140
Tℓ max – I
F (AV)
160
Maximum allowable lead temperature
T
ℓ
max (°C)
Maximum allowable temperature
Ta max (°C)
120
100
α =
60°
80
60
40
0°
α
360°
Rectangular
waveform
Device mounted on a ceramic board:
board size: 50 mm
×
50 mm
soldering land:
2 mm
×
2 mm
board thickness:
0.64 t
140
120
100
80
60
40
0°
α
360°
α =
60°
Rectangular
waveform
120°
180°
DC
120°
180°
DC
IF (AV)
20 Conduction
angle
α
VR
=
15 V
0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
IF (AV)
20 Conduction
angle
α
VR
=
15 V
0
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Average forward current
I
F (AV)
(A)
Average forward current
I
F (AV)
(A)
r
th (j-a)
– t
1000
500
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 2.1 mm
×
1.4 mm
board thickness: 1.6 t
Transient thermal impedance
rth (j-a) (°C/W)
300
100
50
30
Device mounted on a glass-epoxy board:
board size: 50 mm
×
50 mm
Soldering land: 6.0 mm
×
6.0 mm
board thickness: 1.6 t
10
5
3
Device mounted on a ceramic board:
board size: 50 mm
×
50 mm
Soldering land: 2.0 mm
×
2.0 mm
board thickness: 0.64 t
0.003
0.01
0.03
0.1
0.3
1
3
1
0.001
10
30
100
300
1000
Time t (s)
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2006-11-13
CMS17
Surge forward current
(nonrepetitive)
C
j
– V
R
1000
(typ.)
Ta
=
25°C
f
=
1 MHz
(A)
40
Ta
=
25°C
f
=
50 Hz
30
C
j
(pF)
Junction capacitance
I
FSM
500
300
Peak surge forward current
20
100
50
30
10
0
1
3
5
10
30
50
100
10
1
3
5
10
30
50
100
Number of cycles
Reverse voltage
VR
(V)
I
R
– T
j
100
Pulse test
10
(typ.)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
VR
α
P
R (AV)
– V
R
Rectangular
waveform
0°
360°
(typ.)
(mA)
VR
=
30 V
1
Average reverse power dissipation
P
R (AV)
(W)
Reverse current IR
DC
300°
240°
180°
120°
60°
0.1
20 V
10 V
Conduction angle
α
Tj
=
150°C
0.01
3V
0.001
5V
0.0001
0
20
40
60
80
100
120
140
160
4
8
12
16
20
24
28
Junction temperature Tj
(°C)
Reverse voltage
VR
(V)
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2006-11-13
CMS17
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
20070701-EN
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-13
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