Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | SCANNABLE |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 座面最大高度 | 5.715 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| 74ACT818DCQR | 74ACT818PC | 74ACT818PCQR | 74ACT818QCQR | 74ACT818DC | |
|---|---|---|---|---|---|
| 描述 | Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24 | Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, PLASTIC, DIP-24 | Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, PLASTIC, DIP-24 | Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, PQCC28, PLASTIC, LCC-28 | Bus Driver, ACT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, CERAMIC, DIP-24 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | DIP, | DIP, | QCCJ, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | SCANNABLE | SCANNABLE | SCANNABLE | SCANNABLE | SCANNABLE |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 | R-GDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 28 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | QCCJ | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 座面最大高度 | 5.715 mm | 5.08 mm | 5.08 mm | 4.57 mm | 5.715 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 11.5062 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Is Samacsys | N | - | - | N | N |
| 长度 | - | 31.75 mm | 31.75 mm | 11.5062 mm | - |
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