IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | 1.060 X 0.310 INCH, CERDIP-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| Is Samacsys | N |
| 最长转换时间 | 0.975 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-GDIP-T20 |
| JESD-609代码 | e0 |
| 模拟输入通道数量 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 25 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8951801RB | 5962-8951801RX | 5962-89518012C | 5962-89518012B | 5962-89518012X | 5962-8951801RC | |
|---|---|---|---|---|---|---|
| 描述 | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC20, LCC-20, Analog to Digital Converter | IC 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP20, 1.060 X 0.310 INCH, CERDIP-20, Analog to Digital Converter |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | QLCC | DIP |
| 包装说明 | 1.060 X 0.310 INCH, CERDIP-20 | DIP, | LCC-20 | LCC-20 | QCCN, | DIP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长转换时间 | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs | 0.975 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | QCCN | QCCN | QCCN | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 220 | 220 | 220 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Qualified | Not Qualified | Not Qualified | Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.54 mm | 2.54 mm | 2.54 mm | 5.08 mm |
| 最大压摆率 | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA | 25 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
嵌入式系统
FPGA/CPLD
微控制器 MCU
嵌入式系统
汽车电子
LED专区
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
