IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | LCC |
| 包装说明 | CERAMIC, LCC-44 |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| Is Samacsys | N |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-CQCC-N44 |
| JESD-609代码 | e0 |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 采样速率 | 5 MHz |
| 筛选级别 | MIL-STD-883 |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-9468602MYX | 5962-9468602MYA | 5962-9468601MXX | |
|---|---|---|---|
| 描述 | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44, Analog to Digital Converter | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQCC44, CERAMIC, LCC-44, Analog to Digital Converter | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDIP28, CERAMIC, DIP-28, Analog to Digital Converter |
| 是否无铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | LCC | DIP |
| 包装说明 | CERAMIC, LCC-44 | CERAMIC, LCC-44 | CERAMIC, DIP-28 |
| 针数 | 44 | 44 | 28 |
| Reach Compliance Code | compliant | not_compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大模拟输入电压 | 1 V | 1 V | 1 V |
| 最小模拟输入电压 | -1 V | -1 V | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-CQCC-N44 | S-CQCC-N44 | R-CDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 |
| 标称负供电电压 | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | DIP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 5 MHz | 5 MHz | 5 MHz |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
