ADC, Proprietary Method, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, PDSO28, 8.40 MM, SOIC-28
| 参数名称 | 属性值 |
| 厂商名称 | Exar |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 最大模拟输入电压 | 3 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | R-PDSO-G28 |
| 长度 | 17.85 mm |
| 最大线性误差 (EL) | 0.061% |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 采样速率 | 1 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 2.9 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 8.4 mm |
| Base Number Matches | 1 |
| XRD87L94AIK28 | XRD87L94AID28 | XRD87L94AIP28 | |
|---|---|---|---|
| 描述 | ADC, Proprietary Method, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, PDSO28, 8.40 MM, SOIC-28 | ADC, Proprietary Method, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, PDSO28, 0.300 INCH, SOIC-28 | ADC, Proprietary Method, 12-Bit, 1 Func, 1 Channel, Serial Access, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 |
| 厂商名称 | Exar | Exar | Exar |
| 零件包装代码 | SOIC | SOIC | DIP |
| 包装说明 | SOP, | SOP, | DIP, |
| 针数 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N |
| 最大模拟输入电压 | 3 V | 3 V | 3 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 |
| 长度 | 17.85 mm | 17.9 mm | 37.4 mm |
| 最大线性误差 (EL) | 0.061% | 0.061% | 0.061% |
| 模拟输入通道数量 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 1 MHz | 1 MHz | 1 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 2.9 mm | 2.65 mm | 6.35 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 宽度 | 8.4 mm | 7.5 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
