Multiplexer, 850S Series, 1-Func, 16 Line Input, 1 Line Output, True Output, PDSO24, 4.40 X 7.80 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO1-53, TSSOP-24
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 系列 | 850S |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e3 |
| 长度 | 7.8 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 16 |
| 输出次数 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 850S1601AGILFT | 850S1601AGIT | 850S1601AGI | 850S1601AGILF | |
|---|---|---|---|---|
| 描述 | Multiplexer, 850S Series, 1-Func, 16 Line Input, 1 Line Output, True Output, PDSO24, 4.40 X 7.80 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO1-53, TSSOP-24 | Multiplexer, 850S Series, 1-Func, 16 Line Input, 1 Line Output, True Output, PDSO24, 4.40 X 7.80 MM, 0.925 MM HEIGHT, MO1-53, TSSOP-24 | Multiplexer, 850S Series, 1-Func, 16 Line Input, 1 Line Output, True Output, PDSO24, 4.40 X 7.80 MM, 0.925 MM HEIGHT, MO1-53, TSSOP-24 | Multiplexer, 850S Series, 1-Func, 16 Line Input, 1 Line Output, True Output, PDSO24, 4.40 X 7.80 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO1-53, TSSOP-24 |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | TSSOP, | TSSOP, | TSSOP, | TSSOP, |
| 针数 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| 系列 | 850S | 850S | 850S | 850S |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e3 | e0 | e0 | e3 |
| 长度 | 7.8 mm | 7.8 mm | 7.8 mm | 7.8 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | 1 | 1 |
| 输入次数 | 16 | 16 | 16 | 16 |
| 输出次数 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 240 | 240 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | TIN LEAD | TIN LEAD | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Is Samacsys | N | - | N | N |
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