2.0 mm x 2.5 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
ISM95 Series
Product Features:
Low Jitter, Non-PLL Based Output
CMOS/TTL Compatible Logic Levels
Compatible with Leadfree Processing
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
2.5
2.0
Frequency
Output Level
HC-MOS
TTL
Duty Cycle
Rise / Fall Time
Output Load
Frequency Stability
Start-up Time
Enable / Disable
Time
Supply Voltage
Current
Operating
Storage
Jitter:
RMS(1sigma)
1 MHz-60 MHz
Max Integrated
1 MHz-60 MHz
Max Total Jitter
1 MHz-60 MHz
1.000 MHz to 60.000 MHz
‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min.
‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min.
Specify 50% ±10% or ±5% See Table in Part Number Guide
5 nS Max. @ Vcc = +3.3 VDC, 10 nS Max. @ Vcc = +5 VDC ***
Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL See Table in Part Number
Guide
See Frequency Stability Table (Includes room temperature tolerance and
stability over operating temperature)
10 mS Max.
100 nS Max. N.C. or
≥
70% Vdd = Enable.
≤
30% Vdd = Disable.
Recommended Pad Layout
0.6
See Input Voltage Table, tolerance ±5 %
25 mA Max. ***
See Operating Temperature Table in Part Number Guide
-55
°
C to +125
°
C
5 pS RMS (1 sigma) Max. accumulated jitter (20K adjacent periods)
1.5 pS RMS (1 sigma -12KHz to 20MHz)
50 pS p-p (100K adjacent periods)
Pin
1
2
3
4
Connection
Enable
GND
Output
Vcc
Dimension Units: mm
Part Number Guide
Package
I
SM95 -
Input
Voltage
5 = 5.0 V
3 = 3.3 V
7 = 3.0 V
2 = 2.7 V
6 = 2.5 V
1 = 1.8 V*
Sample Part Number:
Operating
Temperature
1 = 0° C to +70° C
8 = -10° C to +60° C
6 = -10° C to +70° C
3 = -20° C to +70° C
4 = -30° C to +75° C
2 = -40° C to +85° C
ISM95 - 3251BH - 20.000
Output
1 = 10TTL / 15 pF HC-MOS
6 = 30 pF
5 = 50 pF HC-MOS (<40 MHz)
Symmetry
(Duty Cycle)
5 = 45 / 55 Max.
6 = 40 / 60 Max.
Stability
(in ppm)
**A =
±25
B =
±50
C =
±100
Enable /
Disable
H = Enable
O = N/C
Frequency
- 20.000 MHz
NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise.
* Not available at all frequencies. ** Not available for all temperature ranges. *** Frequency, supply, and load related parameters.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
2.0 mm x 2.5 mm Ceramic Package SMD Oscillator, TTL / HC-MOS
Pb Free Solder Reflow Profile:
ISM95 Series
Typical Application:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N.A. (package does not contain plastic, storage life is
unlimited under normal room conditions).
Termination = e4 (Au over Ni over W base metalization).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-.3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI and Date Code (YWW)
Line 2: Frequency
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
NXP MCU
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