REVISIONS
LTR
A
B
C
D
E
F
G
H
J
DESCRIPTION
Add Appendix A for a microcircuit die.
Changes in accordance with N.O.R. 5962-R032-97.
Make changes to boilerplate and add device class T device. - ro
Add device type 02. - ro
Make change to propagation delay test for device type 02 as specified under
table I. - ro
Make change to propagation delay test for device type 02 as specified under
table I. Updated boilerplate to reflect current requirements. - lgt
Make correction to DC diode input current description as specified in 1.3. - ro
Add vendor CAGE F8859. Updated footnote 2/ in table I to accommodate
RHA designator “D”. - rrp
Make corrections to title block, figure 1 and figure 2. - ro
Make change to the output skew test subgroup 10 limit for device type 02 only
as specified under Table I. Add paragraphs 2.2 and 6.7. Make changes to
paragraph 4.4.4.3 and Table IIB. - ro
Add device types 03, 04 and table IB. Make changes to footnote 1/ and add
footnote 3/ under Table IIA. Delete Table III and references to device class M
requirements. - ro
Add case outline Y. Add note under figure 1. - ro
DATE (YR-MO-DA)
96-11-06
98-12-03
00-08-04
00-08-29
01-09-06
02-07-09
02-11-27
05-04-01
09-04-07
APPROVED
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
J. RODENBECK
K
L
13-02-27
13-06-05
C. SAFFLE
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
L
15
L
16
L
17
L
18
REV
SHEET
PREPARED BY
SANDRA ROONEY
L
19
L
20
L
21
L
1
L
22
L
2
L
23
L
3
L
4
L
5
L
6
L
7
L
8
L
9
L
10
L
11
L
12
L
13
L
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
SANDRA ROONEY
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
95-11-21
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL-LINEAR, RADIATION
HARDENED CMOS, QUAD DIFFERENTIAL LINE
DRIVER, MONOLITHIC SILICON
SIZE
A
CAGE CODE
AMSC N/A
REVISION LEVEL
L
67268
SHEET
1 OF 23
5962-96663
DSCC FORM 2233
APR 97
5962-E365-13
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device class Q), space
application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case outlines and
lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation
Hardness Assurance (RHA) levels is reflected in the PIN. For device class T, the user is encouraged to review the
manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN is as shown in the following example:
5962
-
96663
01
V
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
26C31RH
26CLV31RH
26C31EH
26CLV31EH
Circuit function
Radiation hardened quad differential line driver
Radiation hardened quad differential line driver
Radiation hardened quad differential line driver
Radiation hardened quad differential line driver
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Q, V
T
Device requirements documentation
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan.
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
X
Y
Descriptive designator
GDIP2-T16
CDFP4-F16
CDFP4-F16
Terminals
16
16
16
Package style
Dual-in-line
Flat pack
Flat pack with grounded lid
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96663
SHEET
L
2
1.3 Absolute maximum ratings. 1/
Supply voltage ........................................................................................................... -0.5 V dc to +7.0 V dc
INPUTS, E,
E
voltage ............................................................................................... -0.5 V dc to V
DD
+ 0.5 V dc
Output voltage with power on or off (0 V) ..................................................................
DC diode input current (any input) .............................................................................
DC drain current (any one output) .............................................................................
DC V
DD
or ground current ..........................................................................................
Storage temperature range ........................................................................................
Maximum package dissipation (T
A
= +125°C) (P
D
): 2/
Case outline E ......................................................................................................... 0.68 W
Case outlines X and Y ............................................................................................. 0.44 W
Thermal resistance, junction-to-case (θ
JC
):
Case outline E ......................................................................................................... 24°C/W
Case outline X and Y ............................................................................................... 29°C/W
Thermal resistance, junction-to-ambient (θ
JA
):
Case outline E ......................................................................................................... 73°C/W
Case outlines X and Y ............................................................................................. 114°C/W
Lead temperature (soldering, 10 seconds) ................................................................ +300°C
Junction temperature (T
J
) .......................................................................................... +175°C
1.4 Recommended operating conditions.
Operating voltage range:
Device types 01 and 03 ............................................................................................ +4.5 V dc to +5.5 V dc
Device types 02 and 04 ............................................................................................ +3.0 V dc to +3.6 V dc
Input rise and fall time ............................................................................................... 500 ns maximum
Low input voltage (V
IL
) .............................................................................................. 0 V to 0.3 V
DD
maximum
High input voltage (V
IH
) ............................................................................................. V
DD
to +0.7 V
DD
minimum
Ambient operating temperature (T
A
) ......................................................................... -55°C to +125°C
-0.5 V dc to +7.0 V dc
±
20 mA
350 mA
400 mA
-65°C to +150°C
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ If device power exceeds package dissipation capacity, provide heat sinking or derate linearly (the derating is based
on (θ
JA
) at the following rates:
Case outline E ........................................................................................................... 13.7 mW/°C
Case outlines X and Y ............................................................................................... 8.8 mW/°C
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96663
SHEET
L
3
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s):
Device types 01 and 02:
Device classes Q or V ........................................................................................
Device class T ....................................................................................................
Device types 03 and 04 .........................................................................................
Maximum total dose available (dose rate
≤
0.01 rad(Si)/s):
Device types 03 and 04 .........................................................................................
Single event phenomena (SEP):
300 krads(Si) 3/
100 krads(Si) 3/
300 krads(Si) 4/
50 krads(Si) 4/
2
No SEL occurs at effective LET (see 4.4.4.2.2) .....................................................
≤
100 MeV/mg/cm
2. APPLICABLE DOCUMENTS
5/
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA, 19428-2959).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
______
3/ Device types 01 and 02 radiation end point limits for the noted parameters are guaranteed only for the conditions as
specified in MIL-STD-883, method 1019, condition A to a maximum total dose of 300 krads(Si) for device class V or Q and
100 krads(Si) for device class T.
4/ Device types 03 and 04 radiation end point limits for the noted parameters are guaranteed only for the conditions as
specified in MIL-STD-883, method 1019, condition A to a maximum total dose of 300 krads(Si), and condition D to a
maximum total dose of 50 krads(Si).
5/ Limits obtained during technology characterization/qualification, guaranteed by design or process, but not production
tested unless specified by the customer through the purchase order or contract.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96663
SHEET
L
4
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q, T and V.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as required
in MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q, T and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535
shall be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-96663
SHEET
L
5
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