IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,LDCC,28PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | S-PQCC-J28 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.048 A |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC28,.5SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流(ICC) | 40 mA |
| Prop。Delay @ Nom-Sup | 19 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| SN74BCT29828FN | SN74BCT29828NT | SN74BCT29828DW | SN74BCT29828JT | |
|---|---|---|---|---|
| 描述 | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,LDCC,28PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,SOP,24PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,10-BIT,BICMOS-TTL,DIP,24PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| Is Samacsys | N | N | N | N |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | S-PQCC-J28 | R-PDIP-T24 | R-PDSO-G24 | R-XDIP-T24 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I(ol) | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | QCCJ | DIP | SOP | DIP |
| 封装等效代码 | LDCC28,.5SQ | DIP24,.3 | SOP24,.4 | DIP24,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | SMALL OUTLINE | IN-LINE |
| Prop。Delay @ Nom-Sup | 19 ns | 19 ns | 19 ns | 19 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | YES | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 最大电源电流(ICC) | 40 mA | 40 mA | 40 mA | - |
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