100K SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP24,.4 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | WITH DUAL CLOCK |
| 系列 | 100K |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 375000000 Hz |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | -4.5 V |
| 最大电源电流（ICC） | 135 mA |
| 传播延迟（tpd） | 2.6 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 5.72 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 10.16 mm |
| 最小 fmax | 375 MHz |
| Base Number Matches | 1 |
| 5962-9457901VXA | 5962-9457901MYA | 5962-9457901MXA | 4108T-2-2701BAA | 4108T-2-2701BAB | RM100351WFQMLV | |
|---|---|---|---|---|---|---|
| 描述 | 100K SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24, CERAMIC, DIP-24 | 100K SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, QFP24, QFP-24 | 100K SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP24, CERAMIC, DIP-24 | Array/Network Resistor, Isolated, Thin Film, 0.2W, 2700ohm, 50V, 0.1% +/-Tol, -100,100ppm/Cel, 4726, | Array/Network Resistor, Isolated, Thin Film, 0.2W, 2700ohm, 50V, 0.1% +/-Tol, -100,100ppm/Cel, 4726, | 100K SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQFP24, CERQUAD-24 |
| Reach Compliance Code | unknown | unknown | unknown | not_compliant | not_compliant | compliant |
| 系列 | 100K | 100K | 100K | 4100T | 4100T | 100K |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 24 | 24 | 8 | 8 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | DIP | DIP | FLATPACK |
| 技术 | ECL | ECL | ECL | THIN FILM | THIN FILM | ECL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn63Pb37) |
| 包装说明 | DIP, DIP24,.4 | DFP, QFL24,.4SQ | DIP, DIP24,.4 | - | - | QFF, |
| JESD-30 代码 | R-GDIP-T24 | S-XQFP-F24 | R-GDIP-T24 | - | - | S-GQFP-F24 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - | D FLIP-FLOP |
| 位数 | 6 | 6 | 6 | - | - | 6 |
| 功能数量 | 1 | 1 | 1 | - | - | 1 |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | UNSPECIFIED | CERAMIC, GLASS-SEALED | - | - | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DFP | DIP | - | - | QFF |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | - | - | SQUARE |
| 传播延迟（tpd） | 2.6 ns | 2.6 ns | 2.6 ns | - | - | 2.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V | MIL-STD-883 | MIL-STD-883 | - | - | MIL-PRF-38535 Class V |
| 座面最大高度 | 5.72 mm | 2.16 mm | 5.72 mm | - | - | 2.159 mm |
| 表面贴装 | NO | YES | NO | - | - | YES |
| 温度等级 | MILITARY | MILITARY | MILITARY | - | - | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | - | - | FLAT |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | - | - | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | - | - | QUAD |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - | POSITIVE EDGE |
| 最小 fmax | 375 MHz | 375 MHz | 375 MHz | - | - | 375 MHz |
| Base Number Matches | 1 | 1 | 1 | - | - | 1 |
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