IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,LLCC,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 厂商名称 | National Semiconductor（TI ） |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 控制类型 | ENABLE LOW |
| JESD-30 代码 | S-XQCC-N20 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 54ACT540LM | 54ACT540FM | 54ACT540DM | 74ACT540SC | 74ACT540PC | |
|---|---|---|---|---|---|
| 描述 | IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,FP,20PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,SOP,20PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,8-BIT,ACT-CMOS,DIP,20PIN,PLASTIC |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 代码 | S-XQCC-N20 | R-XDFP-F20 | R-XDIP-T20 | R-PDSO-G20 | R-PDIP-T20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | DFP | DIP | SOP | DIP |
| 封装等效代码 | LCC20,.35SQ | FL20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 包装说明 | - | DFP, FL20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
51单片机
聊聊、笑笑、闹闹
聊聊、笑笑、闹闹
创意市集
无线连接
DIY/开源硬件专区
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
