Rambus DRAM, 4MX16, CMOS, PBGA74, BGA-74
参数名称 | 属性值 |
厂商名称 | Rambus Inc |
零件包装代码 | BGA |
包装说明 | TFBGA, |
针数 | 74 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
访问模式 | BLOCK ORIENTED PROTOCOL |
其他特性 | SELF CONTAINED REFRESH |
JESD-30 代码 | R-PBGA-B74 |
内存密度 | 67108864 bit |
内存集成电路类型 | RAMBUS DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 74 |
字数 | 4194304 words |
字数代码 | 4000000 |
工作模式 | SYNCHRONOUS |
组织 | 4MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
自我刷新 | YES |
最大供电电压 (Vsup) | 2.63 V |
最小供电电压 (Vsup) | 2.37 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.75 mm |
端子位置 | BOTTOM |
Base Number Matches | 1 |
64MD-50-711 | 72MD-50-711 | 64MD-45-800 | 72MD-45-711 | 64MD-40-800 | 64MD-45-711 | 64MD-53-600 | 72MD-40-800 | 72MD-53-600 | 72MD-45-800 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Rambus DRAM, 4MX16, CMOS, PBGA74, BGA-74 | Rambus DRAM, 4MX18, CMOS, PBGA54, CENTER BONDED, BGA-54 | Rambus DRAM, 4MX16, 45ns, CMOS, PBGA74, BGA-74 | Rambus DRAM, 4MX18, CMOS, PBGA54, CENTER BONDED, BGA-54 | Rambus DRAM, 4MX16, 40ns, CMOS, PBGA74, BGA-74 | Rambus DRAM, 4MX16, CMOS, PBGA74, BGA-74 | Rambus DRAM, 4MX16, 53ns, CMOS, PBGA74, BGA-74 | Rambus DRAM, 4MX18, 40ns, CMOS, PBGA54, CENTER BONDED, BGA-54 | Rambus DRAM, 4MX18, 53ns, CMOS, PBGA54, CENTER BONDED, BGA-54 | Rambus DRAM, 4MX18, 45ns, CMOS, PBGA54, CENTER BONDED, BGA-54 |
厂商名称 | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc | Rambus Inc |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
针数 | 74 | 54 | 74 | 54 | 74 | 74 | 74 | 54 | 54 | 54 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
JESD-30 代码 | R-PBGA-B74 | R-PBGA-B54 | R-PBGA-B74 | R-PBGA-B54 | R-PBGA-B74 | R-PBGA-B74 | R-PBGA-B74 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 |
内存密度 | 67108864 bit | 75497472 bit | 67108864 bit | 75497472 bit | 67108864 bit | 67108864 bit | 67108864 bit | 75497472 bit | 75497472 bit | 75497472 bi |
内存集成电路类型 | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
内存宽度 | 16 | 18 | 16 | 18 | 16 | 16 | 16 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 74 | 54 | 74 | 54 | 74 | 74 | 74 | 54 | 54 | 54 |
字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
组织 | 4MX16 | 4MX18 | 4MX16 | 4MX18 | 4MX16 | 4MX16 | 4MX16 | 4MX18 | 4MX18 | 4MX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
最长访问时间 | - | - | 45 ns | - | 40 ns | - | 53 ns | 40 ns | 53 ns | 45 ns |
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