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89HPES5T5ZBBCGI8

产品描述CABGA-196, Reel
产品类别微控制器和处理器   
文件大小438KB,共29页
制造商IDT (Integrated Device Technology)
标准  
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89HPES5T5ZBBCGI8概述

CABGA-196, Reel

89HPES5T5ZBBCGI8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明LBGA, BGA196,14X14,40
针数196
制造商包装代码BCG196
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID11130466
Samacsys Pin Count196
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryBGA
Samacsys Footprint Name196-Pin BGA
Samacsys Released Date2020-01-31 12:10:38
Is SamacsysN
地址总线宽度
总线兼容性PCI; SMBUS
最大时钟频率125 MHz
最大数据传输速率2500 MBps
外部数据总线宽度
JESD-30 代码S-PBGA-B196
JESD-609代码e1
长度15 mm
湿度敏感等级3
端子数量196
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA196,14X14,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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5-Lane 5-Port PCI Express®
Switch
®
89PES5T5
Data Sheet
The 89HPES5T5 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES5T5 is an 5-lane, 5-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Five 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x1
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates five 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 5 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
June 18, 2014

89HPES5T5ZBBCGI8相似产品对比

89HPES5T5ZBBCGI8 89HPES5T5ZBBCGI 89HPES5T5ZBBCG 89HPES5T5ZBBCG8 89HPES5T5ZBBC 89HPES5T5ZBBCI 89HPES5T5ZBBC8 89HPES5T5ZBBCI8
描述 CABGA-196, Reel CABGA-196, Tray CABGA-196, Tray CABGA-196, Reel CABGA-196, Tray CABGA-196, Tray CABGA-196, Reel CABGA-196, Reel
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 不含铅 不含铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 符合 符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA CABGA CABGA CABGA CABGA CABGA CABGA
包装说明 LBGA, BGA196,14X14,40 CABGA-196 CABGA-196 LBGA, BGA196,14X14,40 CABGA-196 CABGA-196 CABGA-196 CABGA-196
针数 196 196 196 196 196 196 196 196
制造商包装代码 BCG196 BCG196 BCG196 BCG196 BC196 BC196 BC196 BC196
Reach Compliance Code compliant compliant compliant compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Is Samacsys N N N N N N N N
总线兼容性 PCI; SMBUS PCI PCI PCI; SMBUS PCI PCI PCI; SMBUS PCI; SMBUS
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196
JESD-609代码 e1 e1 e1 e1 e0 e0 e0 e0
长度 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
湿度敏感等级 3 3 3 3 3 3 3 3
端子数量 196 196 196 196 196 196 196 196
最高工作温度 85 °C 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA
封装等效代码 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40 BGA196,14X14,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 260 260 260 260 225 225 225 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED 30 30 NOT SPECIFIED 20 20 NOT SPECIFIED NOT SPECIFIED
宽度 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1 1 1 1
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