2-input NAND gate; open drain
| 74LVC1G38 | 74LVC1G38GV | 74LVC1G38GM | 74LVC1G38GW | 74LVC1G38GF | |
|---|---|---|---|---|---|
| 描述 | 2-input NAND gate; open drain | 2-input NAND gate; open drain | 2-input NAND gate; open drain | 2-input NAND gate; open drain | 2-input NAND gate; open drain |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | SC-74A | SON | TSSOT | SON |
| 包装说明 | - | PLASTIC, SOT-753, SC-74A, 5 PIN | VSON, SOLCC6,.04,20 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 | VSON, SOLCC6,.04,14 |
| 针数 | - | 5 | 6 | 5 | 6 |
| Reach Compliance Code | - | compli | compli | compli | compli |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | - | R-PDSO-G5 | R-PDSO-N6 | R-PDSO-G5 | S-PDSO-N6 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 |
| 长度 | - | 2.9 mm | 1.45 mm | 2.05 mm | 1 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 输入次数 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | 5 | 6 | 5 | 6 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | VSON | TSSOP | VSON |
| 封装等效代码 | - | TSOP5/6,.11,37 | SOLCC6,.04,20 | TSSOP5/6,.08 | SOLCC6,.04,14 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | 5.7 ns | 5.7 ns | 5.7 ns | 5.7 ns |
| 传播延迟（tpd） | - | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.1 mm | 0.5 mm | 1.1 mm | 0.5 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | - | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | - | 0.95 mm | 0.5 mm | 0.65 mm | 0.35 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 30 |
| 宽度 | - | 1.5 mm | 1 mm | 1.25 mm | 1 mm |
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