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89HPES16T4AG2ZAAL

产品描述PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324
产品类别微控制器和处理器   
文件大小759KB,共31页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

89HPES16T4AG2ZAAL概述

PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324

89HPES16T4AG2ZAAL规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA,
针数324
Reach Compliance Codenot_compliant
ECCN代码3A001.A.3
Is SamacsysN
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
最大时钟频率100 MHz
驱动器接口标准IEEE 1149.1
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度19 mm
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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16-Lane 4-Port
Gen2 PCI Express® Switch
®
89HPES16T4AG2
Data Sheet
Advance Information*
Device Overview
The 89HPES16T4AG2 is a member of IDT’s PRECISE™ family of
PCI Express® switching solutions. The PES16T4AG2 is a 16-lane, 4-
port Gen2 peripheral chip that performs PCI Express Base switching
with a feature set optimized for high performance applications such as
servers, storage, and communications/networking. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to three downstream ports and supports switching between down-
stream ports.
Features
Block Diagram
4-Port Switch Core / 16 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 1)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
©
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
December 4, 2007
DSC 6928
Advance Information
High Performance PCI Express Switch
– Sixteen 5 Gbps Gen2 PCI Express lanes
– Four switch ports
• One x8 or x4 upstream port
• Up to three x4 downstream ports
– Low latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates sixteen 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
– Supports Hot-Swap

89HPES16T4AG2ZAAL相似产品对比

89HPES16T4AG2ZAAL 89HPES16T4AG2ZAAR
描述 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, FCBGA-324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, ROHS COMPLIANT, FCBGA-324
是否无铅 含铅 不含铅
是否Rohs认证 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA BGA
包装说明 BGA, BGA,
针数 324 324
Reach Compliance Code not_compliant compliant
ECCN代码 3A001.A.3 3A001.A.3
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
最大时钟频率 100 MHz 100 MHz
驱动器接口标准 IEEE 1149.1 IEEE 1149.1
JESD-30 代码 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e3
长度 19 mm 19 mm
端子数量 324 324
最高工作温度 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 225 260
认证状态 Not Qualified Not Qualified
座面最大高度 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V
标称供电电压 1 V 1 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Matte Tin (Sn)
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30
宽度 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI

 
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