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89HPES12N3A1ZCBCG8

产品描述Bus Controller, PBGA324
产品类别微控制器和处理器   
文件大小294KB,共31页
制造商IDT (Integrated Device Technology)
标准
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89HPES12N3A1ZCBCG8概述

Bus Controller, PBGA324

89HPES12N3A1ZCBCG8规格参数

参数名称属性值
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
JESD-30 代码S-PBGA-B324
JESD-609代码e1
湿度敏感等级3
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
电源1,3.3 V
认证状态Not Qualified
表面贴装YES
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
Base Number Matches1

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12-lane 3-Port
PCI Express® Switch
®
89HPES12N3A
Data Sheet
Device Overview
The 89HPES12N3A is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES12N3A is a 12-lane, 3-port
peripheral chip that performs PCI Express packet switching with a
feature set optimized for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Twelve 2.5Gbps PCI Express lanes
– Three switch ports
– Upstream port configurable up to x4
– Downstream ports configurable up to x4
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 2048 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twelve 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Supports ECRC and Advanced Error Reporting
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC and
server motherboards
Block Diagram
3-Port Switch Core
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Scheduler
Transaction Layer
Data Link Layer
Multiplexer/Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Transaction Layer
Data Link Layer
Multiplexer/Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Transaction Layer
Data Link Layer
Multiplexer/Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes SerDes SerDes SerDes
SerDes SerDes SerDes
SerDes
SerDes SerDes SerDes SerDes
12 PCI Express Lanes
One x4 Upstream Port and Two x4 Downstream Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 31
©
2010 Integrated Device Technology, Inc.
April 9, 2010
DSC 6922

89HPES12N3A1ZCBCG8相似产品对比

89HPES12N3A1ZCBCG8 89HPES12N3A1ZCBCG 89HPES12N3AZCBCGI
描述 Bus Controller, PBGA324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, CABGA-324 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, CABGA-324
是否Rohs认证 符合 符合 符合
Reach Compliance Code compliant compli compli
ECCN代码 EAR99 EAR99 EAR99
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e1 e1
湿度敏感等级 3 3 3
端子数量 324 324 324
最高工作温度 70 °C 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA LBGA LBGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
电源 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL
端子节距 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1
是否无铅 - 不含铅 不含铅
零件包装代码 - BGA BGA
包装说明 - LBGA, BGA324,18X18,40 LBGA, BGA324,18X18,40
针数 - 324 324
其他特性 - ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
总线兼容性 - PCI PCI
最大时钟频率 - 125 MHz 125 MHz
长度 - 19 mm 19 mm
峰值回流温度(摄氏度) - 260 260
座面最大高度 - 1.5 mm 1.5 mm
最大供电电压 - 1.1 V 1.1 V
最小供电电压 - 0.9 V 0.9 V
标称供电电压 - 1 V 1 V
技术 - CMOS CMOS
处于峰值回流温度下的最长时间 - 30 30
宽度 - 19 mm 19 mm
uPs/uCs/外围集成电路类型 - BUS CONTROLLER, PCI BUS CONTROLLER, PCI

 
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