Asynchronous 32-bit PCI-to-PCI Bridge
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | PLX Technology, Inc. (Broadcom ) |
零件包装代码 | QFP |
包装说明 | FQFP, QFP208,1.2SQ,20 |
针数 | 208 |
Reach Compliance Code | unknow |
ECCN代码 | 3A001.A.3 |
地址总线宽度 | 32 |
最大时钟频率 | 66 MHz |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e0 |
长度 | 28 mm |
端子数量 | 208 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FQFP |
封装等效代码 | QFP208,1.2SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, FINE PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3.3 V |
认证状态 | Not Qualified |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 28 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI |
PCI6350-AA66PC | PCI6350-AA66BC | PCI6350 | PCI6350-AA66PCG | PCI6350RDK | PCI6350-AA66BCG | |
---|---|---|---|---|---|---|
描述 | Asynchronous 32-bit PCI-to-PCI Bridge | Asynchronous 32-bit PCI-to-PCI Bridge | Asynchronous 32-bit PCI-to-PCI Bridge | Asynchronous 32-bit PCI-to-PCI Bridge | Asynchronous 32-bit PCI-to-PCI Bridge | Asynchronous 32-bit PCI-to-PCI Bridge |
是否Rohs认证 | 不符合 | 不符合 | - | 符合 | - | 符合 |
厂商名称 | PLX Technology, Inc. (Broadcom ) | PLX Technology, Inc. (Broadcom ) | - | PLX Technology, Inc. (Broadcom ) | - | PLX Technology, Inc. (Broadcom ) |
零件包装代码 | QFP | BGA | - | QFP | - | BGA |
包装说明 | FQFP, QFP208,1.2SQ,20 | BGA, BGA256,16X16,40 | - | FQFP, | - | BGA, |
针数 | 208 | 256 | - | 208 | - | 256 |
Reach Compliance Code | unknow | unknow | - | compli | - | compli |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | - | 3A001.A.3 | - | 3A001.A.3 |
地址总线宽度 | 32 | 32 | - | 32 | - | 32 |
最大时钟频率 | 66 MHz | 66 MHz | - | 66 MHz | - | 66 MHz |
外部数据总线宽度 | 32 | 32 | - | 32 | - | 32 |
JESD-30 代码 | S-PQFP-G208 | S-PBGA-B256 | - | S-PQFP-G208 | - | S-PBGA-B256 |
长度 | 28 mm | 17 mm | - | 28 mm | - | 17 mm |
端子数量 | 208 | 256 | - | 208 | - | 256 |
最高工作温度 | 70 °C | 70 °C | - | 70 °C | - | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | FQFP | BGA | - | FQFP | - | BGA |
封装形状 | SQUARE | SQUARE | - | SQUARE | - | SQUARE |
封装形式 | FLATPACK, FINE PITCH | GRID ARRAY | - | FLATPACK, FINE PITCH | - | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
最大供电电压 | 3.6 V | 3.6 V | - | 3.6 V | - | 3.6 V |
最小供电电压 | 3 V | 3 V | - | 3 V | - | 3 V |
标称供电电压 | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
表面贴装 | YES | YES | - | YES | - | YES |
技术 | CMOS | CMOS | - | CMOS | - | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL |
端子形式 | GULL WING | BALL | - | GULL WING | - | BALL |
端子节距 | 0.5 mm | 1 mm | - | 0.5 mm | - | 1 mm |
端子位置 | QUAD | BOTTOM | - | QUAD | - | BOTTOM |
宽度 | 28 mm | 17 mm | - | 28 mm | - | 17 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | - | BUS CONTROLLER, PCI | - | BUS CONTROLLER, PCI |
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