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IDT72T36115L6-7BBGI

产品描述FIFO, 128KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
产品类别存储    存储   
文件大小240KB,共8页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT72T36115L6-7BBGI概述

FIFO, 128KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240

IDT72T36115L6-7BBGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
针数240
Reach Compliance Codecompli
ECCN代码EAR99
JESD-30 代码S-PBGA-B240
JESD-609代码e1
长度19 mm
内存密度4718592 bi
内存宽度36
湿度敏感等级3
功能数量1
端子数量240
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织128KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.97 mm
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
Base Number Matches1

文档预览

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2.5 VOLT HIGH-SPEED TeraSync
TM
FIFO 36-BIT CONFIGURATIONS
65,536 x 36, 131,072 x 36,
262,144 x 36
ADVANCE INFORMATION
IDT72T36105
IDT72T36115
IDT72T36125
FEATURES:
Choose among the following memory organizations:
IDT72T36105
65,536 x 36
IDT72T36115
131,072 x 36
IDT72T36125
262,144 x 36
Up to 200 MHz Operation of Clocks
Functionally compatible to the 32,768 x36 TeraSync devices
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input disables Write Port HSTL inputs
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 240-pin (19mm x 19mm)Plastic Ball Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
FUNCTIONAL BLOCK DIAGRAM
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
WCS
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
FLAG
LOGIC
RAM ARRAY
65,536 x 36
131,072 x 36
262,144 x 36
WRITE POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5993 drw01
Q
0
-Q
n
(x36, x18 or x9)
ERCLK
The IDT logo is a registered trademark and the TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2001 Integrated Device Technology, Inc.
MAY 2001
DSC-5993/-

IDT72T36115L6-7BBGI相似产品对比

IDT72T36115L6-7BBGI IDT72T36115L6-7BBI IDT72T36105L6-7BBGI IDT72T36105L6-7BBI IDT72T36125L6-7BBGI IDT72T36125L6-7BBI
描述 FIFO, 128KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 FIFO, 128KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 FIFO, 64KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 FIFO, 64KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 FIFO, 256KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 FIFO, 256KX36, Asynchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
是否无铅 不含铅 含铅 不含铅 含铅 不含铅 含铅
是否Rohs认证 符合 不符合 符合 不符合 符合 不符合
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
针数 240 240 240 240 240 240
Reach Compliance Code compli _compli compliant not_compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240
JESD-609代码 e1 e0 e1 e0 e1 e0
长度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
内存密度 4718592 bi 4718592 bi 2359296 bit 2359296 bit 9437184 bit 9437184 bit
内存宽度 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 240 240 240 240 240 240
字数 131072 words 131072 words 65536 words 65536 words 262144 words 262144 words
字数代码 128000 128000 64000 64000 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 128KX36 128KX36 64KX36 64KX36 256KX36 256KX36
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 225 260 225 260 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.97 mm 1.97 mm 1.97 mm 1.97 mm 1.97 mm 1.97 mm
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN SILVER COPPER Tin/Lead (Sn/Pb) TIN SILVER COPPER Tin/Lead (Sn/Pb) TIN SILVER COPPER Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 20 30 20 30 20
宽度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
Base Number Matches 1 1 1 1 1 1
厂商名称 - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

 
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