5962-8751303XC概述

4KX1 STANDARD SRAM, 45ns, CDFP18, FP-18

5962-8751303XC规格参数

参数名称	属性值
厂商名称	ST(意法半导体)
零件包装代码	DFP
包装说明	DFP,
针数	18
Reach Compliance Code	unknown
ECCN代码	3A001.A.2.C
Is Samacsys	N
最长访问时间	45 ns
JESD-30 代码	R-CDFP-F18
JESD-609代码	e4
长度	10.973 mm
内存密度	4096 bit
内存集成电路类型	STANDARD SRAM
内存宽度	1
功能数量	1
端口数量	1
端子数量	18
字数	4096 words
字数代码	4000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	4KX1
输出特性	3-STATE
可输出	NO
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP
封装形状	RECTANGULAR
封装形式	FLATPACK
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	2.235 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	GOLD
端子形式	FLAT
端子节距	1.194 mm
端子位置	DUAL
Base Number Matches	1

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5962-8751303XC相似产品对比

	5962-8751303XC	5962-8751301XC	IMS1203S-25M	5962-8751301VC	5962-8751302XC	5962-8751303VC	5962-8751302VC	IMS1203A-45M	IMS1203A-25M	IMS1203S-45M
描述	4KX1 STANDARD SRAM, 45ns, CDFP18, FP-18	4KX1 STANDARD SRAM, 25ns, CDFP18, FP-18	4KX1 STANDARD SRAM, 25ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18	4KX1 STANDARD SRAM, 25ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18	4KX1 STANDARD SRAM, 35ns, CDFP18, FP-18	4KX1 STANDARD SRAM, 45ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18	4KX1 STANDARD SRAM, 35ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18	4KX1 STANDARD SRAM, 45ns, DFP18, FORMED, FP-18	4KX1 STANDARD SRAM, 25ns, DFP18, FORMED, FP-18	4KX1 STANDARD SRAM, 45ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18
零件包装代码	DFP	DFP	DIP	DIP	DFP	DIP	DIP	DFP	DFP	DIP
包装说明	DFP,	DFP,	DIP, DIP18,.3	DIP,	DFP,	DIP,	DIP,	FORMED, FP-18	FORMED, FP-18	0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18
针数	18	18	18	18	18	18	18	18	18	18
Reach Compliance Code	unknown	unknown	not_compliant	unknown	unknown	unknown	unknown	not_compliant	_compli	not_compliant
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
最长访问时间	45 ns	25 ns	25 ns	25 ns	35 ns	45 ns	35 ns	45 ns	25 ns	45 ns
JESD-30 代码	R-CDFP-F18	R-CDFP-F18	R-CDIP-T18	R-CDIP-T18	R-CDFP-F18	R-CDIP-T18	R-CDIP-T18	R-XDFP-F18	R-XDFP-F18	R-CDIP-T18
JESD-609代码	e4	e4	e0	e4	e4	e4	e4	e0	e0	e0
长度	10.973 mm	10.973 mm	22.86 mm	22.86 mm	10.973 mm	22.86 mm	22.86 mm	10.973 mm	10.973 mm	22.86 mm
内存密度	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	4096 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	1	1	1	1	1	1	1	1	1	1
功能数量	1	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1	1
端子数量	18	18	18	18	18	18	18	18	18	18
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1	4KX1
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
可输出	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
封装代码	DFP	DFP	DIP	DIP	DFP	DIP	DIP	DFP	DFP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	FLATPACK	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	FLATPACK	FLATPACK	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	NO	YES	NO	NO	YES	YES	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子面层	GOLD	GOLD	Tin/Lead (Sn/Pb)	GOLD	GOLD	GOLD	GOLD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT	THROUGH-HOLE
端子节距	1.194 mm	1.194 mm	2.54 mm	2.54 mm	1.194 mm	2.54 mm	2.54 mm	1.194 mm	1.194 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	ST(意法半导体)	-	ST(意法半导体)	-	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)	ST(意法半导体)
Base Number Matches	1	1	1	1	1	1	1	-	-	-

5962-8751303XC

5962-8751303XC概述

5962-8751303XC规格参数

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5962-8751303XC相似产品对比

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