REVISIONS
LTR
A
DESCRIPTION
Drawing updated to reflect current requirements. - lgt
DATE (YR-MO-DA)
01-07-13
APPROVED
Raymond Monnin
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
A
17
A
18
REV
SHEET
PREPARED BY
Joseph A. Kirby
A
19
A
20
A
21
A
1
A
22
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
Michael Frye
MICROCIRCUIT, LINEAR, 8-BIT ANALOG I/O
SYSTEM, MONOLITHIC SILICON
DRAWING APPROVAL DATE
06 May 1991
AMSC N/A
REVISION LEVEL
A
SIZE
A
SHEET
CAGE CODE
67268
1 OF
22
5962-89629
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E488-01
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89629
01
L
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
AD7569S
AD7569T
Circuit function
8-bit analog I/O system
8-bit analog I/O system
Relative Accuracy
1/2 LSB for DAC and ADC
1 LSB for DAC and ADC
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
L
3
Descriptive designator
GDIP3-T24 or CDIP4-T24
CQCC1-N28
Terminals
24
28
Package style
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (V
DD
) to AGND
DAC
or AGND
ADC
.................................... -0.3 V dc to +7.0 V dc
Supply voltage (V
DD
) to DGND ............................................................. -0.3 V dc to +7.0 V dc
V
DD
to V
SS
............................................................................................. -0.3 V dc to +14 V dc
AGND
DAC
or AGND
ADC
to DGND .......................................................... -0.3 V dc to V
DD
+0.3 V dc
AGND
DAC
or AGND
ADC
.........................................................................
5.0 V dc
Logic voltage to DGND......................................................................... -0.3 V dc to V
DD
+0.3 V dc
CLK input voltage to DGND.................................................................. -0.3 V dc to V
DD
+0.3 V dc
Output voltage to AGND
DAC
1/............................................................. V
SS
-0.3 V dc to V
DD
+0.3 V dc
Input voltage to AGND
ADC
.................................................................... V
SS
-0.3 V dc to V
DD
+0.3 V dc
Storage temperature range .................................................................. -65
C to +150
C
Lead temperature (soldering, 10 seconds)........................................... +300
C
Power dissipation (P
D
).......................................................................... 450 mW 2/
Thermal resistance, junction to case (
JC
) ........................................... See MIL-STD-1835
Thermal resistance, junction to ambient (
JA
) ...................................... 120
C/W
Junction temperature (T
J
)..................................................................... +150
C
1.4 Recommended operating conditions.
Supply voltage to ground (V
SS
)............................................................ -4.75 V dc to –5.25 V dc
Supply voltage to ground (V
DD
) ........................................................... +4.75 V dc to +5.25 V dc
Ambient operating temperature range (T
A
) .......................................... -55
C to +125
C
1/
2/
Output may be shorted to any voltage in the range V
SS
to V
DD
provided that the power dissipation of the package is not
exceeded.
Derate above T
A
= +75
C at 6.0 mW/
C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89629
SHEET
A
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Pin descriptions. The pin descriptions shall be as specified on figure 2.
3.2.3 Truth table. The truth table shall be as specified on figure 3.
3.2.4 Input/output voltage ranges and unipolar/bipolar code tables. The input/output voltage ranges and unipolar/bipolar
code tables shall be as specified on figure 4.
3.2.5 Logic diagram. The logic diagram shall be as specified on figure 5.
3.2.6 Load circuits. The load circuits shall be as specified on figure 6.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89629
SHEET
A
3
3.2.7 Write cycle timing waveforms. The write cycle timing waveforms shall be as specified on figure 7.
3.2.8 ADC mode 1 interface timing waveforms. The ADC mode 1 interface timing waveforms shall be as specified on figure
8.
3.2.9 ADC mode 2 interface timing waveforms. The ADC mode 2 interface timing waveforms shall be as specified on figure
9.
3.2.10 Equivalent input voltage circuit. The equivalent input voltage circuit shall be as specified on figure 10.
3.2.11 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
(2) T
A
= +125
C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89629
SHEET
A
4
TABLE I. Electrical performance characteristics.
Conditions 1/
C
L
= 100 pF to AGND
DAC
R
L
= 2.0 k
-55
C
T
A
+125
C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Limits
Unit
Min
DAC specifications
Relative accuracy
INL
01
02
Differential
nonlinearity
DNL
Guaranteed monotonic
01
02
Unipolar offset error
DAC data is all zeros,
V
SS
= 0 V
ALL
01
02
Bipolar zero offset
error
DAC data is all zeros,
V
SS
= -5.0 V
ALL
01
02
Full-scale error
V
DD
= 5.0 V
2/
ALL
01
02
1, 2, 3
1
2, 3, 12
1, 2, 3
1
2, 3, 12
1
2, 3
2, 3
1, 12
1
2, 3
2, 3
1, 12
1
2, 3
2, 3
12
1
Max
1.0
1.0
1/2
1.0
1.0
3/4
2.0
2.5
2.0
1.5
2.0
2.5
2.0
1.5
2.0
4.0
3.0
1.0
0.5
LSB
LSB
LSB
LSB
LSB
Full scale
V
DD
Full scale
V
SS
Digital input voltage
low level
Digital input voltage
high level
Input leakage current
Positive power supply
current
V
IL
V
IH
I
IL
I
DD
T
A
= +25
C,
V
OUT
= 2.5 V,
ALL
LSB
V
DD
=
5%
T
A
= +25
C,
V
OUT
= -2.5 V,
ALL
1
0.5
LSB
V
SS
=
5%
ALL
ALL
V
IN
= 0 to V
DD
V
OUT
= V
IN
= 2.5 V,
Logic units = 2.4 V,
CLK = 0.8 V, output
unloaded
ALL
ALL
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
2.4
10
13
0.8
V
V
A
mA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89629
SHEET
A
5
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
