电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MV1N5945BUR-1A

产品描述Zener Diode, 68V V(Z), 10%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小377KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MV1N5945BUR-1A概述

Zener Diode, 68V V(Z), 10%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

MV1N5945BUR-1A规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码DO-213AB
包装说明O-LELF-R2
针数2
Reach Compliance Codecompli
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压68 V
表面贴装YES
技术ZENER
端子面层TIN LEAD
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差10%
工作测试电流5.5 mA
Base Number Matches1

文档预览

下载PDF文档
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB
package is similar in electrical features to the JEDEC registered 1N5913B
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection
for applications of high density and low parasitic requirements. Due to its
glass hermetic qualities and metallurgically enhanced internal contacts, it
may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as
described in Features below. Zener voltage tolerance options are identified
by part number suffix including tight-tolerance. A variety of other Zener
product offerings and packages are available by Microsemi to meet higher
or lower power and test current applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Electrically similar to the JEDEC registered 1N5913B
thru 1N5956B zener series
Zener voltages available 3.3V to 200V
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers, e.g. MX1N5913BUR-1,
MV1N5923CUR-1, MSP1N5952DUR-1, etc.
Surface mount equivalents also available as
SMBJ5913B to SMBJ5956B, SMBG5913B to
SMBG5956B, SMAJ5913B to SMAJ5956B, or as
1PMT5913B to 1PMT5956B (see separate data
sheets)
Plastic body axial-leaded Zener equivalents are also
available as 1N5913BP to 1N5956BP (see separate
data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Leadless package for surface mounting
Ideal for high density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Standard voltage tolerances are +/- 5% with B suffix
and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to +175
º
C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power: 1.50 watts at T
EC
< 115
o
C, or
1.25 watts at T
A
= 25
º
C when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed DO-213AB glass MELF
package
TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N5913BUR-1−1N5956BUR-1
Copyright
2005
1-04-2005 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
【K210系列】4. 还不完善的MicroPython
本来想等官方出新版本固件后在发这一贴,因为现在的版本实在是难以使用,缺失了很多重要功能。但是看起来K210的移植进度非常慢,等了快2周也没有更新,所以就先简单测试一下。 上电后,运行 ......
dcexpert MicroPython开源版块
STM32批量价格,哪里最便宜
想用一款带FSMC功能的做产品,现在算开发成本...
sakuragirl stm32/stm8
PCB“有铅”工艺和“无铅”的差异
PCB生产中,工艺是一个极其重要的环节,一般工艺有osp,沉金,镀金、喷锡等。其中喷锡作为PCB生产中最为常见的工艺,大家都不陌生,在喷锡工艺中,又分为“有铅”和“无铅”两种,这两者有什 ......
zpcbdxjj PCB设计
谁有1602的显示程序啊,,网上好多,但用不了
用lm3s811驱动1602显示字符。。。不知道怎么写。。求帮助...
snowhy ARM技术
大功率LED封装工艺系列之焊线篇
1目的 在压力、热量和超声波能量的共同作用下,使金丝在芯片电极和外引线键合区之间形成 良好的欧姆接触,完成内外引线的连接。 2. 技术要求 2.1 金丝与芯片电极、引线框架键合区间的连接牢 ......
探路者 LED专区
ZigBee将成为新的蓝牙
  大多数IT专业人士和消费者都非常熟悉蓝牙数据通信标准,但知道ZigBee无线标准的人却少之又少。目前,ZigBee技术刚刚开始在工业应用中部署,仍处于大规模采用的前期阶段。不过,随着面向消费 ......
吸铁石上 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2599  712  2342  1530  261  53  15  48  31  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved