AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | AC |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.305 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 139000000 Hz |
| 最大I（ol） | 0.012 A |
| 位数 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3/5 V |
| 传播延迟（tpd） | 10.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| 最小 fmax | 187 MHz |
| Base Number Matches | 1 |
| 74AC175PCQR | 74ACT175PC | 74ACT175SC | 74ACT175PCQR | 74AC175SC | |
|---|---|---|---|---|---|
| 描述 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, 0.300 INCH, PLASTIC, DIP-16 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP16, PLASTIC, DIP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16, 0.150 INCH, PLASTIC, SOIC-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 系列 | AC | ACT | ACT | - | AC |
| JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | - | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 |
| 长度 | 19.305 mm | 19.305 mm | 9.9 mm | - | 9.9 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 139000000 Hz | 145000000 Hz | 145000000 Hz | - | 139000000 Hz |
| 最大I（ol） | 0.012 A | 0.024 A | 0.024 A | - | 0.012 A |
| 位数 | 4 | 4 | 4 | - | 4 |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 16 | 16 | 16 | - | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | - | SOP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | SOP16,.25 | - | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE |
| 电源 | 3.3/5 V | 5 V | 5 V | - | 3.3/5 V |
| 传播延迟（tpd） | 10.5 ns | 12 ns | 12 ns | - | 10.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 1.75 mm | - | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 5.5 V | - | 6 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | - | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | NO | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE |
| 宽度 | 7.62 mm | 7.62 mm | 3.9 mm | - | 3.9 mm |
| 最小 fmax | 187 MHz | 145 MHz | 145 MHz | - | 187 MHz |
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