Line Driver, 4 Func, 4 Driver, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-422; EIA-423 |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 标称负供电电压 | -5 V |
| 功能数量 | 4 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 筛选级别 | MIL-PRF-38535 |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| 最大传输延迟 | 375 ns |
| Base Number Matches | 1 |
| 5962-86721012A | AM26LS30PCB | 5962-8672101EA | 5962-8672101FA | AM26LS30/B2A | |
|---|---|---|---|---|---|
| 描述 | Line Driver, 4 Func, 4 Driver, CQCC20, CERAMIC, LCC-20 | Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16, PLASTIC, DIP-16 | Line Driver, 4 Func, 4 Driver, CDIP16, CERAMIC, DIP-16 | Line Driver, 4 Func, 4 Driver, CDFP16, CERAMIC, FP-16 | Line Driver, 4 Func, 4 Driver, BIPolar, CQCC20, LLCC-20 |
| 零件包装代码 | QLCC | DIP | DIP | DFP | QLCC |
| 包装说明 | QCCN, | DIP, DIP16,.3 | DIP, | DFP, | QCCN, LCC20,.35SQ |
| 针数 | 20 | 16 | 16 | 16 | 20 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 差分输出 | YES | YES | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 | 4 | 4 |
| 输入特性 | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-422; EIA-423 | EIA-422; EIA-423 | EIA-422; EIA-423 | EIA-422; EIA-423 | EIA-422; EIA-423 |
| JESD-30 代码 | S-CQCC-N20 | R-PDIP-T16 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 20 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DIP | DFP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES |
| 温度等级 | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD |
| 最大传输延迟 | 375 ns | 200 ns | 375 ns | 375 ns | 300 ns |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) |
| 标称负供电电压 | -5 V | -5 V | - | -5 V | -5 V |
| 筛选级别 | MIL-PRF-38535 | - | MIL-STD-883 | MIL-PRF-38535 | 38535Q/M;38534H;883B |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
单片机
嵌入式系统
聊聊、笑笑、闹闹
聊聊、笑笑、闹闹
嵌入式系统
NXP MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
