Rambus DRAM, 2MX16, CMOS, BGA-74
| 参数名称 | 属性值 |
| 厂商名称 | Rambus Inc |
| 零件包装代码 | BGA |
| 包装说明 | , |
| 针数 | 74 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL |
| JESD-30 代码 | R-XBGA-B74 |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | RAMBUS DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 74 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 组织 | 2MX16 |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | BALL |
| 端子位置 | BOTTOM |
| Base Number Matches | 1 |
| 32MD-50-800 | 362MD-40-800 | 32MD-45-800 | 32MD-40-800 | 36MD-45-800 | 36MD-50-800 | |
|---|---|---|---|---|---|---|
| 描述 | Rambus DRAM, 2MX16, CMOS, BGA-74 | Rambus DRAM, 2MX18, CMOS, CENTER BONDED, BGA-54 | Rambus DRAM, 2MX16, CMOS, BGA-74 | Rambus DRAM, 2MX16, CMOS, BGA-74 | Rambus DRAM, 2MX18, CMOS, CENTER BONDED, BGA-54 | Rambus DRAM, 2MX18, CMOS, CENTER BONDED, BGA-54 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 针数 | 74 | 54 | 74 | 74 | 54 | 54 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
| JESD-30 代码 | R-XBGA-B74 | R-XBGA-B54 | R-XBGA-B74 | R-XBGA-B74 | R-XBGA-B54 | R-XBGA-B54 |
| 内存密度 | 33554432 bit | 37748736 bi | 33554432 bit | 33554432 bit | 37748736 bit | 37748736 bit |
| 内存集成电路类型 | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
| 内存宽度 | 16 | 18 | 16 | 16 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 74 | 54 | 74 | 74 | 54 | 54 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 2MX16 | 2MX18 | 2MX16 | 2MX16 | 2MX18 | 2MX18 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
| 最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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