D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 75000000 Hz |
| 最大I（ol） | 0.012 A |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 74ACQ273PC | 54ACTQ273FMQB | 54ACTQ273DMQB | 54ACTQ273LMQB | 74ACQ273SCQR | 74ACQ273PCQR | |
|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDFP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, CQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDSO20, | D Flip-Flop, 8-Func, Positive Edge Triggered, CMOS, PDIP20, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | SOP, SOP20,.4 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T20 | R-XDFP-F20 | R-XDIP-T20 | S-XQCC-N20 | R-PDSO-G20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大I（ol） | 0.012 A | 0.024 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A |
| 功能数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DFP | DIP | QCCN | SOP | DIP |
| 封装等效代码 | DIP20,.3 | FL20,.3 | DIP20,.3 | LCC20,.35SQ | SOP20,.4 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE |
| 电源 | 3.3/5 V | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V |
| 表面贴装 | NO | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 最大频率@ Nom-Sup | 75000000 Hz | - | 85000000 Hz | 85000000 Hz | 75000000 Hz | 75000000 Hz |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
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