REVISIONS
LTR
A
B
C
D
E
DESCRIPTION
Changes in accordance with NOR 5962-R044-96.
Changes in accordance with NOR 5962-R460-97.
Update boilerplate for class “T” changes. - glg
Correction of paragraph 1.5 Table I changes. - glg
Correction of test condition voltage value for
E
in Table I for
Operating supply current; was VDD changed to GND. Removed
neutron irradiation line from section 1.5. Update boilerplate. - ksr
DATE (YR-MO-DA)
96-01-24
97-09-22
98-12-02
99-06-24
04-02-12
APPROVED
M.A. Frye
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
E
15
E
16
E
17
REV
SHEET
PREPARED BY
Gary L. Gross
CHECKED BY
Jeff Bowling
APPROVED BY
Michael A. Frye
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
10
E
11
E
12
E
13
E
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DRAWING APPROVAL DATE
95-10-05
REVISION LEVEL
E
MICROCIRCUIT, MEMORY,
DIGITAL, RADIATION HARDENED,
CMOS, 8K X 8-BIT PROM,
MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
17
5962-E140-04
CAGE CODE
67268
5962-95626
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V), and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturers Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN shall be as shown in the following example:
5962
│
│
│
Federal
stock class
designator
\
F
│
│
│
RHA
designator
(see 1.2.1)
/
95626
01
│
│
│
Device
type
(see 1.2.2)
V
│
│
│
Device
class
designator
(see 1.2.3)
Y
│
│
│
Case
outline
(see 1.2.4)
C
│
│
│
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices shall meet the MIL-PRF-38535 specified RHA levels
and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535 appendix
A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types shall identify the circuit function as follows:
Device type 1/
01
Generic number 2/
HS-6664RH
Circuit function
8K X 8-bit Radiation hardened PROM
Access time
65 ns
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan
Q, V
T
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
CDIP2-T28
CDFP3-F28
Terminals
28
28
Package style
Dual-in-line package
Flat pack
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38535 for classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
__________________
1/ Device is available in an unprogrammed state only.
2/ Generic numbers are also listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document
and will also be listed in QML-38535 and MIL-HDBK-103.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95626
SHEET
E
2
1.3 Absolute maximum ratings. 3/
Supply voltage range .....................................................................
Voltage on any pin with respect to ground .....................................
Maximum power dissipation (P
D
) ...................................................
Lead temperature (soldering, 10 seconds maximum)....................
Thermal resistance, junction-to-case (Θ
JC
) ....................................
Junction temperature (T
J
)...............................................................
Storage temperature range ............................................................
Temperature under bias.................................................................
1.4 Recommended operating conditions.
Supply voltage (V
DD
) .......................................................................
Ground voltage (GND) ....................................................................
Input high voltage (V
IH
) ...................................................................
Input Low voltage (V
IL
) ....................................................................
Case operating temperature range (T
C
)..........................................
1.5 Radiation features
Maximum total dose available (dose rate = 50 - 300 rads(Si)/s)
Class M, Q, and V .........................................................................
Class T..........................................................................................
Dose rate upset...............................................................................
Dose rate survivability.....................................................................
Single event phenomenon (SEP) effective
linear energy threshold (LET) with no upsets................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
300 Krads(Si)
100 KRads(Si)
8
> 5 x 10 Rads(Si)/sec 4/
11
> 5 x 10 Rads(Si)/sec 4/
> 100 MEV-cm /mg 4/
2
-0.3 V dc to +7.0 V dc
-0.3 V dc to V
DD
+0.3 V dc
1.75 W
+300°C
See MIL-STD-1835
+175°C
-65°C to +150°C
-55°C to +125°C
+4.5 V dc to +5.5 V dc
0.0 V dc
+2.4 V dc minimum to V
CC
0.0 V dc to +0.8 V dc maximum
-55°C to +125°C
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_____________________
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ Guaranteed by process or design, but not tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95626
SHEET
E
3
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DoDISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to:
ASTM International, PO Box C700, 100 Barr
Harbor Drive, West Conshohocken, PA 19428-2959;
http://www.astm.org.)
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
22201;
http://www.jedec.org.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535, and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A and herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2. When required
in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or C (see 4.4), the devices shall be
programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall be programmed.
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not a part of this drawing.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified in figure 5.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95626
SHEET
E
4
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as required
in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of MIL-PRF-38535
and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q, T and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 42 (see MIL-PRF-38535, appendix A).
3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through final electrical testing as defined in
3.2.3.1 and table I. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan, including screening (4.2),
qualification (4.3), and conformance inspection (4.4). The modification in the QM plan shall not affect the form, fit, or function
as described herein.
For device class T, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 and the device
manufacturer's QM plan, including screening, qualification, and conformance inspection. The performance envelope and
reliability information shall be as specified in the manufacturers QM plan.
For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
For device class T, screening shall be in accordance with the device manufacturer's Quality Management (QM) plan, and shall
be conducted on all devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. For device class M, the test circuit shall be maintained by the manufacturer under document revision level control and
shall be made available to the preparing or acquiring activity upon request. For device class M, the test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015.
(1)
Dynamic burn-in for device class M (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c. Interim and final electrical parameters shall be as specified in table IIA herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-95626
SHEET
E
5
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
