Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, ROHS COMPLIANT, TSOP2-44
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | TSOP2 |
包装说明 | ROHS COMPLIANT, TSOP2-44 |
针数 | 44 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 15 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e3 |
长度 | 18.41 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 16 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP44,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大待机电流 | 0.02 A |
最小待机电流 | 3 V |
最大压摆率 | 0.17 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
Base Number Matches | 1 |
71V416VS15PHG | 71V416VS15BEG | 71V416VS15BEGI | 71V416VL15PHG | 71V416VL15PHGI | 71V416VS15PHGI | 71V416VS15PHGI8 | 71V416VS10BEGI | 71V416VS10BEGI8 | |
---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, ROHS COMPLIANT, TSOP2-44 | Standard SRAM, 256KX16, 15ns, CMOS, PBGA48, 9 X 9 MM, ROHS COMPLIANT, BGA-48 | Standard SRAM, 256KX16, 15ns, CMOS, PBGA48, 9 X 9 MM, ROHS COMPLIANT, BGA-48 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, ROHS COMPLIANT, TSOP2-44 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, ROHS COMPLIANT, TSOP2-44 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, ROHS COMPLIANT, TSOP2-44 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44 | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 9 X 9 MM, ROHS COMPLIANT, BGA-48 | Application Specific SRAM, 256KX16, 10ns, CMOS, PBGA48, 9 X 9 MM, ROHS COMPLIANT, BGA-48 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
Reach Compliance Code | unknown | compliant | unknown | unknown | compliant | unknown | unknown | compliant | compliant |
最长访问时间 | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 10 ns | 10 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G44 | S-PBGA-B48 | S-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | S-PBGA-B48 | R-PBGA-B48 |
JESD-609代码 | e3 | e1 | e1 | e3 | e3 | e3 | e3 | e1 | e1 |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | APPLICATION SPECIFIC SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 4 |
端子数量 | 44 | 48 | 48 | 44 | 44 | 44 | 44 | 48 | 48 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | TFBGA | TFBGA | TSOP2 | TSOP2 | TSOP2 | TSOP | TFBGA | BGA |
封装等效代码 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 |
封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.02 A | 0.02 A | 0.02 A | 0.01 A | 0.01 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
最小待机电流 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
最大压摆率 | 0.17 mA | 0.17 mA | 0.17 mA | 0.16 mA | 0.16 mA | 0.17 mA | 0.17 mA | 0.2 mA | 0.2 mA |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | TIN SILVER COPPER |
端子形式 | GULL WING | BALL | BALL | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL |
端子节距 | 0.8 mm | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm |
端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
零件包装代码 | TSOP2 | BGA | BGA | TSOP2 | TSOP2 | TSOP2 | - | BGA | - |
包装说明 | ROHS COMPLIANT, TSOP2-44 | 9 X 9 MM, ROHS COMPLIANT, BGA-48 | 9 X 9 MM, ROHS COMPLIANT, BGA-48 | ROHS COMPLIANT, TSOP2-44 | ROHS COMPLIANT, TSOP2-44 | ROHS COMPLIANT, TSOP2-44 | - | 9 X 9 MM, ROHS COMPLIANT, BGA-48 | BGA, BGA48,6X8,30 |
针数 | 44 | 48 | 48 | 44 | 44 | 44 | - | 48 | - |
ECCN代码 | 3A991.B.2.A | 3A991 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A | - |
长度 | 18.41 mm | 9 mm | 9 mm | 18.41 mm | 18.41 mm | 18.41 mm | - | 9 mm | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | - | 260 | 260 |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | - | 1.2 mm | - |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | - | 3 V | 3 V |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | - | 30 | 30 |
宽度 | 10.16 mm | 9 mm | 9 mm | 10.16 mm | 10.16 mm | 10.16 mm | - | 9 mm | - |
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