电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

71V65602S133BGGI

产品描述ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
产品类别存储   
文件大小970KB,共26页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 全文预览

71V65602S133BGGI概述

ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

71V65602S133BGGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明14 X 22 MM, PLASTIC, BGA-119
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间4.2 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B119
JESD-609代码e1
长度22 mm
内存密度9437184 bit
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX36
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度2.36 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65602
IDT71V65802
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad and
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Description
The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used to
disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be initiated.
However, any pending data transfers (reads or writes) will be completed. The
data bus will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65602/5802 have an on-chip burst counter. In the burst
mode, the IDT71V65602/5802 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is defined
by the
LBO
input pin. The
LBO
pin selects between linear and interleaved burst
sequence. The ADV/LD signal is used to load a new external address (ADV/
LD
= LOW) or increment the internal burst counter (ADV/LD = HIGH).
The IDT71V65602/5802 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA)
and a 165 fine pitch ball grid array (fBGA).
Pin Description Summary
A
0
-A
18
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5303 tbl 01
CE
1
, CE
2
,
CE
2
OE
R/
W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/
LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2004
DSC-5303/05
1
©2004 Integrated Device Technology, Inc.
这个系统的开关电路使用这样的设计是出于什么考虑?
今天看到一个这样的电路,电路图很简单,我有个疑问,正常我设计系统的开关电路的时候, 都是直接使用一个开关去开断系统的VCC,这个电路这样使用开关去控制MOS管的通断,进而 实现系统VCC的 ......
MrKingMCU 电源技术
毕业设计——220kv电网潮流计算
任务书 (一):已知 (1)系统最大运行方式为四台发电机满发和系统投入运行;系统最小运行方式为停两台发电机(F1,F3),各负荷减半. (2)系统各负荷及线路参数如图所示,各变压器及发电机型 ......
songbo 单片机
430单片机之定时器A功能的大致介绍
总的来说,430单片机一共有三个定时器,定时器A,定时器B,还有就是看门狗定时器,这里我们主要是讨论430单片机的定时器A的功能,定时器A的功能是我目前见过最厉害的定时器,视频上说用好 ......
Jacktang 微控制器 MCU
ZigBee 烟雾报警实验
194687194688194689194690 请问一下 标号1 那个地方为什么要定义一个周期呢,意义是什么? 标号2 那个地方整体的含义是什么? 非常谢谢!  ......
小小漫 无线连接
pic18 starterkit 学习0x14——串口bootloader使用1
本帖最后由 mzb2012 于 2017-3-12 23:08 编辑 此内容由EEWORLD论坛网友mzb2012原创,如需转载或用于商业用途需征得作者同意并注明出处 一、简介 bootLoader就是单片机引导加载程序 ......
mzb2012 单片机
PCB电镀工艺知识资料
一. 电镀工艺的分类: 酸性光亮铜电镀 电镀镍/金 电镀锡 二. 工艺流程: 浸酸→全板电镀铜→图形转移→酸性除油→二级逆流漂洗→微蚀→二级→浸酸→镀锡→二级逆流漂洗 逆流 ......
方学放 PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 435  1989  824  2019  2751  3  6  39  47  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved