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IDT72V275L10PF8

产品描述FIFO, 32KX18, 6.5ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64
产品类别存储   
文件大小201KB,共25页
制造商IDT (Integrated Device Technology)
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IDT72V275L10PF8概述

FIFO, 32KX18, 6.5ns, Synchronous, CMOS, PQFP64, PLASTIC, TQFP-64

IDT72V275L10PF8规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LQFP, QFP64,.66SQ,32
针数64
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间6.5 ns
最大时钟频率 (fCLK)100 MHz
周期时间10 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度14 mm
内存密度589824 bit
内存集成电路类型OTHER FIFO
内存宽度18
湿度敏感等级3
功能数量1
端子数量64
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP64,.66SQ,32
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.015 A
最大压摆率0.06 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.8 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

文档预览

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3.3 VOLT CMOS SuperSync FIFO™
32,768 X 18
65,536 X 18
IDT72V275
IDT72V285
.EATURES:
Choose among the following memory organizations:
IDT72V275
32,768 x 18
IDT72V285
65,536 x 18
Pin-compatible with the IDT72V255/72V265 SuperSync FIFOs
10ns read/write cycle time (6.5ns access time)
Fixed, low first word data latency time
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable
settings
Retransmit operation with fixed, low first word data
latency time
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of two preselected offsets
Program partial flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
Independent Read and Write clocks (permit reading and writing
simultaneously)
Available in the 64-pin Thin Quad Flat Pack (TQFP) and the 64-pin
Slim Thin Quad Flat Pack (STQFP)
High-performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
DESCRIPTION:
The IDT72V275/72V285 are exceptionally deep, high speed, CMOS
First-In-First-Out (FIFO) memories with clocked read and write controls.
These FIFOs offer numerous improvements over previous SuperSync
FIFOs, including the following:
The limitation of the frequency of one clock input with respect to the other
has been removed. The Frequency Select pin (FS) has been removed,
thus it is no longer necessary to select which of the two clock inputs, RCLK
or WCLK, is running at the higher frequency.
The period required by the retransmit operation is now fixed and short.
The first word data latency period, from the time the first word is written to
an empty FIFO to the time it can be read, is now fixed and short. (The
variable clock cycle counting delay associated with the latency period
found on previous SuperSync devices has been eliminated on this
SuperSync family.)
SuperSync FIFOs are particularly appropriate for network, video, telecom-
munications, data communications and other applications that need to buffer
large amounts of data.
.UNCTIONAL BLOCK DIAGRAM
WEN
WCLK
D
0
-D
17
LD SEN
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
WRITE CONTROL
LOGIC
RAM ARRAY
32,768 x 18
65,536 x 18
FLAG
LOGIC
WRITE POINTER
READ POINTER
OUTPUT REGISTER
MRS
PRS
READ
CONTROL
LOGIC
RT
RESET
LOGIC
RCLK
REN
OE
Q
0
-Q
17
4512 drw 01
SuperSyncFIFO is a trademark and the IDT logo is a registered trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2001
Integrated Device Technology, Inc.
APRIL 2001
DSC-4512/1
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