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HYI25D512160C: 产品描述512-Mbit Double-Data-Rate SDRAM; 文件大小992KB，共35页; 制造商QIMONDA

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HYI25D512160C概述

512-Mbit Double-Data-Rate SDRAM

HYI25D512160C相似产品对比

	HYI25D512160C	HYI25D512160CC-5	HYI25D512160CT-5	HYI25D512160CC-6	HYI25D512160CT-6	HYI25D512160CE-6	HYI25D512160CF-6	HYI25D512160CF-5	HYI25D512160CE-5
描述	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM	512-Mbit Double-Data-Rate SDRAM
是否Rohs认证	-	不符合	不符合	不符合	不符合	符合	符合	符合	符合
厂商名称	-	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA	QIMONDA
零件包装代码	-	BGA	TSOP2	BGA	TSOP2	TSOP2	BGA	BGA	TSOP2
包装说明	-	TBGA, BGA60,9X12,40/32	TSOP2, TSSOP66,.46	TBGA, BGA60,9X12,40/32	TSOP2, TSSOP66,.46	TSOP2, TSSOP66,.46	TBGA, BGA60,9X12,40/32	TBGA, BGA60,9X12,40/32	TSOP2, TSSOP66,.46
针数	-	60	66	60	66	66	60	60	66
Reach Compliance Code	-	unknown	unknow	unknown	unknow	unknow	unknow	unknow	unknow
ECCN代码	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	-	0.7 ns	0.7 ns	0.7 ns	0.7 ns	0.7 ns	0.7 ns	0.7 ns	0.7 ns
其他特性	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
最大时钟频率 (fCLK)	-	200 MHz	200 MHz	166 MHz	166 MHz	166 MHz	166 MHz	200 MHz	200 MHz
I/O 类型	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
交错的突发长度	-	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8
JESD-30 代码	-	R-PBGA-B60	R-PDSO-G66	R-PBGA-B60	R-PDSO-G66	R-PDSO-G66	R-PBGA-B60	R-PBGA-B60	R-PDSO-G66
长度	-	12 mm	22.22 mm	12 mm	22.22 mm	22.22 mm	12 mm	12 mm	22.22 mm
内存密度	-	536870912 bit	536870912 bi	536870912 bit	536870912 bi	536870912 bi	536870912 bi	536870912 bi	536870912 bi
内存集成电路类型	-	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	-	16	16	16	16	16	16	16	16
湿度敏感等级	-	3	1	3	1	1	3	3	1
功能数量	-	1	1	1	1	1	1	1	1
端口数量	-	1	1	1	1	1	1	1	1
端子数量	-	60	66	60	66	66	60	60	66
字数	-	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
字数代码	-	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	-	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16	32MX16
输出特性	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	TBGA	TSOP2	TBGA	TSOP2	TSOP2	TBGA	TBGA	TSOP2
封装等效代码	-	BGA60,9X12,40/32	TSSOP66,.46	BGA60,9X12,40/32	TSSOP66,.46	TSSOP66,.46	BGA60,9X12,40/32	BGA60,9X12,40/32	TSSOP66,.46
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
峰值回流温度（摄氏度）	-	245	245	245	245	260	260	260	260
电源	-	2.6 V	2.6 V	2.5 V	2.5 V	2.5 V	2.5 V	2.6 V	2.6 V
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	-	8192	8192	8192	8192	8192	8192	8192	8192
座面最大高度	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
自我刷新	-	YES	YES	YES	YES	YES	YES	YES	YES
连续突发长度	-	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8	2,4,8
最大待机电流	-	0.0046 A	0.0046 A	0.0046 A	0.0046 A	0.0046 A	0.0046 A	0.0046 A	0.0046 A
最大压摆率	-	0.25 mA	0.25 mA	0.23 mA	0.23 mA	0.23 mA	0.23 mA	0.25 mA	0.25 mA
最大供电电压 (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	-	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	-	YES	YES	YES	YES	YES	YES	YES	YES
技术	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	-	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL	BALL	GULL WING
端子节距	-	1 mm	0.65 mm	1 mm	0.65 mm	0.65 mm	1 mm	1 mm	0.65 mm
端子位置	-	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM	BOTTOM	DUAL
处于峰值回流温度下的最长时间	-	20	20	20	15	30	40	40	40
宽度	-	10 mm	10.16 mm	10 mm	10.16 mm	10.16 mm	10 mm	10 mm	10.16 mm

HYI25D512160C

HYI25D512160C概述

HYI25D512160C相似产品对比

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