H
Intelligent Power Module and
Gate Drive Interface Optocouplers
Technical Data
Features
• Performance Specified for
Common IPM Applications
over Industrial Temperature
Range: -40
°
C to 100
°
C
• Fast Maximum Propagation
Delays
t
PHL
= 400 ns
t
PLH
= 550 ns
• Minimized Pulse Width
Distortion (PWD = 450 ns)
• 15 kV/
µ
s Minimum Common
Mode Transient Immunity at
V
CM
= 1500 V
• CTR > 44% at I
F
= 10 mA
• Safety Approval
UL Recognized - 2500 V rms
for 1 minute (5000 V rms for
1 minute for HCNW4506 and
HCPL-4506 Option 020) per
UL1577
CSA Approved
VDE 0884 Approved
-V
IORM
= 630 V
peak
for
HCPL-4506 Option 060
-V
IORM
= 1414 V
peak
for
HCNW4506
BSI Certified (HCNW4506)
HCPL-4506
HCPL-0466
HCNW4506
Applications
• IPM Isolation
• Isolated IGBT/MOSFET Gate
Drive
• AC and Brushless DC Motor
Drives
• Industrial Inverters
gation delay difference between
devices make these optocouplers
excellent solutions for improving
inverter efficiency through
reduced switching dead time.
An on chip 20 kΩ output pull-up
resistor can be enabled by short-
ing output pins 6 and 7, thus
eliminating the need for an
external pull-up resistor in
common IPM applications. Speci-
fications and performance plots
are given for typical IPM
applications.
Description
The HCPL-4506 and HCPL-0466
contain a GaAsP LED while the
HCNW4506 contains an AlGaAs
LED. The LED is optically
coupled to an integrated high gain
photo detector. Minimized propa-
Functional Diagram
NC
1
20 kΩ
ANODE
2
7
V
L
8
V
CC
Truth Table
LED
ON
OFF
V
O
L
H
CATHODE
3
6
V
O
NC
4
SHIELD
5
GND
Selection Guide
Operating Temperature
T
A
[
°
C]
Min.
-40
-55
Max.
100
125
8-Pin DIP
(300 Mil)
HCPL-4506
Single Channel Packages
Small Outline
SO-8
HCPL-0466
Widebody
(400 Mil)
HCNW4506
Hermetic*
HCPL-5300
HCPL-5301
*Technical data for these products are on separate HP publications.
The connection of a 0.1
µF
bypass capacitor between pins 5 and 8 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
5965-3603E
1-49
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-4506#XXX
020
060
300
500
= UL 5000 V rms/1 Minute Option*
= VDE 0884 V
IORM
= 630 V
peak
Option*
= Gull Wing Surface Mount Option†
= Tape and Reel Packaging Option
*
For HCPL-4506 only. Combination of Option 020 and
Option 060 is not available.
†Gull wing surface mount option applies to through
hole parts only.
Option data sheets are available. Contact your Hewlett-Packard sales representative or authorized
distributor for information.
Package Outline Drawings
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
DATE CODE
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
HP XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
5° TYP.
4.70 (0.185) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS.
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
Figure 1. HCPL-4506 Outline Drawing (Standard DIP Package).
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
1.194 (0.047)
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
1
2
3
4
1.194 (0.047)
1.778 (0.070)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
0.381 (0.015)
0.635 (0.025)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
4.19 MAX.
(0.165)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
Figure 2. HCPL-4506 Gull Wing Surface Mount Option #300 Outline Drawing.
1-50
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
1
2
XXX
YWW
5.842 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
3
4
0.381 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
5.080 ± 0.127
(0.200 ± 0.005)
7°
0.432
45° X (0.017)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.305 MIN.
(0.012)
Figure 3. HCPL-0466 Outline Drawing (8-Pin Small Outline Package).
Pin Location
(for reference only)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
11.00 MAX.
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
TYPE NUMBER
HP
HCNWXXXX
YYWW
1
2
3
4
DATE CODE
10.16 (0.400)
TYP.
1.55
(0.061)
MAX.
7° TYP.
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 4a. HCNW4506 Outline Drawing (8-Pin Widebody Package).
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
PAD LOCATION (FOR REFERENCE ONLY)
6.15 TYP.
(0.242)
9.00 ± 0.15
(0.354 ± 0.006)
12.30 ± 0.30
(0.484 ± 0.012)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
0.9
(0.035)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
Figure 4b. HCNW4506 Outline Drawing (8-Pin Widebody Package with Gull Wing Surface Mount Option 300).
1-51
Solder Reflow Temperature Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
∆T
= 100°C, 1.5°C/SEC
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is recommended.
Regulatory Information
The devices contained in this data
sheet have been approved by the
following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92 (HCNW4506 and
HCPL-4506 Option 060 only).
BSI
Certification according to
BS451:1994
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW4506 only).
Insulation and Safety Related Specifications
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
Widebody
(400 Mil)
Value
Units
9.6
mm
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Symbol
L(101)
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals
to output terminals, along
internal cavity.
DIN IEC 112/VDE 0303 Part 1
L(102)
7.4
4.8
10.0
mm
0.08
0.08
1.0
mm
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
CTI
NA
NA
4.0
mm
200
200
200
Volts
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
1-52
VDE 0884 Insulation Related Characteristics
(HCPL-4506 OPTION 060 ONLY)
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
300 V rms
for rated mains voltage
≤
450 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with t
m
= 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and sample test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 18, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
Characteristic
I-IV
I-III
55/100/21
2
630
1181
Units
V
IORM
V
PR
V
peak
V
peak
V
PR
945
V
peak
V
IOTM
6000
V
peak
T
S
I
S,INPUT
P
S,OUTPUT
R
S
175
230
600
≥
10
9
°C
mA
mW
Ω
VDE 0884 Insulation Related Characteristics (HCNW4506 ONLY)
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
600 V rms
for rated mains voltage
≤
1000 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = V
PR
, 100% Production Test with t
m
= 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = V
PR
, Type and sample test,
t
m
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 18, Thermal Derating curve.)
Case Temperature
Input Current
Output Power
Insulation Resistance at T
S
, V
IO
= 500 V
Symbol
Characteristic
I-IV
I-III
55/100/21
2
1414
2652
Units
V
IORM
V
PR
V
peak
V
peak
V
PR
2121
V
peak
V
IOTM
8000
V
peak
T
S
I
S,INPUT
P
S,OUTPUT
R
S
150
400
700
≥
10
9
°C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
1-53
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