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71V30S25TFG8

产品描述Multi-Port SRAM, 1KX8, 25ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64
产品类别存储   
文件大小130KB,共14页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

71V30S25TFG8概述

Multi-Port SRAM, 1KX8, 25ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64

71V30S25TFG8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
包装说明QFF, QFP64,.47SQ,20
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间25 ns
I/O 类型COMMON
JESD-30 代码S-PQFP-F64
JESD-609代码e3
长度10 mm
内存密度8192 bit
内存集成电路类型MULTI-PORT SRAM
内存宽度8
湿度敏感等级3
功能数量1
端口数量2
端子数量64
字数1024 words
字数代码1000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1KX8
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码QFF
封装等效代码QFP64,.47SQ,20
封装形状SQUARE
封装形式FLATPACK
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.005 A
最小待机电流3 V
最大压摆率0.15 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn) - annealed
端子形式FLAT
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度10 mm
Base Number Matches1

文档预览

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HIGH-SPEED 3.3V
1K X 8 DUAL-PORT
STATIC RAM
Features
IDT71V30S/L
High-speed access
– Commercial: 25/35/55ns (max.)
Low-power operation
– IDT71V30S
Active: 375mW (typ.)
Standby: 5mW (typ.)
– IDT71V30L
Active: 375mW (typ.)
Standby: 1mW (typ.)
On-chip port arbitration logic
Interrupt flags for port-to-port communication
Fully asynchronous operation from either port
Battery backup operation, 2V data retention (L Only)
TTL-compatible, single 3.3V ±0.3V power supply
Industrial temperature range (-40
O
C to +85
O
C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/
W
L
OE
R
CE
R
R/
W
R
I/O
0L
- I/O
7L
I/O
Control
BUSY
L
(1)
I/O
0R
-I/O
7R
I/O
Control
BUSY
R
(1)
A
9L
A
0L
Address
Decoder
10
MEMORY
ARRAY
10
Address
Decoder
A
9R
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
and
INTERRUPT
LOGIC
CE
R
OE
R
R/W
R
INT
L
(2)
INT
R
3741 drw 01
(2)
NOTES:
1. IDT71V30:
BUSY
outputs are non-tristatable push-pulls.
2.
INT
outputs are non-tristable push-pull output structure.
MARCH 2005
1
©2000 Integrated Device Technology, Inc.
DSC 3741/8

71V30S25TFG8相似产品对比

71V30S25TFG8 IDT71V30L55TFG8 71V30L35TFG8 71V30L55TFG8 IDT71V30L35TFG8 IDT71V30S25TFG8 71V30S35TFG8 IDT71V30S35TFG8
描述 Multi-Port SRAM, 1KX8, 25ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64 Multi-Port SRAM, 1KX8, 55ns, CMOS, PQFP64 Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64 Multi-Port SRAM, 1KX8, 55ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64 Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64 Multi-Port SRAM, 1KX8, 25ns, CMOS, PQFP64 Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, GREEN, STQFP-64 Multi-Port SRAM, 1KX8, 35ns, CMOS, PQFP64
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code compliant unknown compliant compliant unknown unknown compliant unknown
最长访问时间 25 ns 55 ns 35 ns 55 ns 35 ns 25 ns 35 ns 35 ns
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQFP-F64 S-PQFP-G64 S-PQFP-F64 S-PQFP-F64 S-PQFP-G64 S-PQFP-G64 S-PQFP-F64 S-PQFP-G64
JESD-609代码 e3 e3 e3 e3 e3 e3 e3 e3
内存密度 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit 8192 bit
内存集成电路类型 MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM MULTI-PORT SRAM
内存宽度 8 8 8 8 8 8 8 8
湿度敏感等级 3 3 3 3 3 3 3 3
端口数量 2 2 2 2 2 2 2 2
端子数量 64 64 64 64 64 64 64 64
字数 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
字数代码 1000 1000 1000 1000 1000 1000 1000 1000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFF QFP QFF QFF QFP QFP QFF QFP
封装等效代码 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20 QFP64,.47SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260 260 260
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.005 A 0.003 A 0.003 A 0.003 A 0.003 A 0.005 A 0.005 A 0.005 A
最小待机电流 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
最大压摆率 0.15 mA 0.105 mA 0.115 mA 0.105 mA 0.115 mA 0.15 mA 0.145 mA 0.145 mA
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 FLAT GULL WING FLAT FLAT GULL WING GULL WING FLAT GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
ECCN代码 EAR99 - EAR99 EAR99 - EAR99 EAR99 -
Base Number Matches 1 1 1 1 1 1 - -

 
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