VS6555
Ultra small reflowable VGA camera module
Data Brief
Features
■
■
■
■
■
■
■
■
■
■
■
VGA resolution sensor (640 x 480)
Electrical and logical interface fully SMIA
compliant
Video data interface - CCP2.0
Command interface - CCI
2.8 V/1.8 V operation
On-board 10-bit ADC
Small physical size (2.5mm height)
Integral EMC shielding
Ultra low power standby mode
On-chip PLL
Lead free reflowable module
As different phone platforms have different
baseband processors with varying capabilities, it
may not be possible for all phones to support the
associated image processing algorithms. Where
the baseband cannot support this processing
load, a separate hardware accelerator (STV0984
or STV0986) device can be incorporated in the
phone system to run the algorithms in hardware.
The STV0984 and STV0986 processors can
support 2 cameras.
The module design is optimized to provide an ultra
small footprint and height, and is designed to be
reflowable at lead-free solder profiles. The product
is lead free.
The lens design is optimized for video
conferencing and maintains its performance even
after the high temperatures of lead-free reflow.
VS6555 offers an ultra low power consumption
hardware standby mode consuming less than
30 µW.
Applications
■
■
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Mobile phone
PDA
Videophone
Description
The VS6555 is an ultra small reflowable VGA
camera module for use across a range of mobile
phone handsets and accessories. It is primarily
designed to be used as a secondary camera for
video conferencing applications, but could equally
be used as a primary camera. The camera silicon
device is SMIA class 0 profile 0 compliant and is
capable of generating raw bayer VGA images up
to 30 fps. The VS6555 supports the CCI control
and CCP2.0 data interfaces
January 2007
Rev 1
1/7
www.st.com
7
For further information contact your local STMicroelectronics sales office.
VS6555
Figure 1.
Application diagram
Figure 2.
Block diagram
VS6555
VGA
Camera
module
STV0984
CLK or
PDN STV0986
processor
CCI
CCP2.0
CLK
PDN
I2C
CCP2.0
or
ITU
Baseband
or
Application
Processor
EXTCLK
XSHUTDOWN
VS6555
PLL and Clock Management
Power Mgmt
CCI
Receiver
Sensor
Control
Registers
Power-On Reset
VGA
Pixel array
1152 x 864
VDIG
DGND
Readout
CCI
CCP2.0
SMIA
receiver
CLKP
CLKN
DATAP
DATAN
CCP2.0
Transmitter
VS6555
VGA
Camera
module
CLK
PDN
Baseband
or
Application
Processor
SCL
SDA
SMIA
profile 0
frame
formatter
Y Decoder
VANA
AGND
Column ADC
X Decoder
Line SRAM
Table 1.
Technical specifications
Parameter
Values
VGA (640 x 480)
0.13 µm HCMOS9i
2.2 µm x 2.2 µm
+8 dB
+24 dB (max)
61 dB
34 dB (@ 100 lux)
< 7lux
Analogue: 2.4V to 2.9V
Digital: 1.8V ± 0.1V
<60 mW
4.5 mm x 4.5 mm x 2.5 mm
66°
78°
3.2
On axis 45% (typ)
Horizontal field (70%) 25% (typical)
< |1%|
> 45% (typ)
Lead free reflowable BGA
[-40; +85]°C
[-30; +70]°C
[-25; +55]°C
[+5; +30]°C
Pixel array
Sensor technology
Pixel size
Exposure control
Analogue gain
Dynamic range
Signal to noise
Minimum illumination
Supply voltage
Average power consumption @ 30fps
Module size (XYZ) max
Lens HFOV (typical)
Lens DFOV (typical)
F number
Lens SFR
Lens TV distortion
Relative illumination
System connectivity
Storage temperature
Functional operating temperature
Normal operating temperature
Optimal operating temperature
2/7
VS6555
Figure 3.
1
2
Z
(AFTER RE-FLOW)
0.10
SEE NOTE 3
05
+0. 2
- 0. 0
. 99
3
4
6
7
8
5
4.50 ±0.10
PIN 1
IDENTIFICATION
A
1.96
SEE NOTE 2
Notes:
1. Mass of module 0.09 Grammes.
2. Class A surface inside this diameter.
3. Flatness of BGA.
A
B
3
B
Module outline drawing (1/3)
E
E
C
EN
D
A
TI
L
OM
C
C
D
FI
N
D
REVISIONS
REV.
A
A1
DESCRIPTION
First Release for Comment
U P D A TE D E X TE N S IV E L Y
DATE
18/04/2006
21 S E P T 06
NY
A
CO
MP
O
Z HEIGHT
2.50±0.10
A2
ON SHT1 VALUE ADDED TO CLASS 'A'
DIAMETER.ON SHT 2 ALL VALUES REVISED IN
CONE VIEWING CONE TABLE.ON SHT 3
EMC CONNECTIONS REVIEWED.ON ALL SHTS
'SUBJECT TO APPROVAL REMOVED.
A3
ON SHT 3. IN TABLE .PIN OUT REF 18 WAS 'NC'
25/10/2006
E
LC
A
PLATING SPECIFICATION
1 micron Cu +0.1 micron st.st.
03/11/2006
E
A4
SHT 1 REMARK AT GRID REF A2:-'MOUNT AND
SUBSTRATE'FROM DIMENSION.
SHT 3 AT GRID REF E6:-'LAND
PATTERN..'DELETED
A5
SHT 2 IN TABLE VALUE 'D' WAS 0.94.VALUE 'E'
WAS 0.75.VALUE 'F' WAS 0.56.
07/11/2006
PART CODE SENSOR RESOLUTION
VS6555R0H9
VGA 640X 480
Interpret drawing per BS8888, 3RD Angle Projection Material
22/11/2006
Tolerances, unless otherwise stated
All dimensions in mm
Finish
SECTION E-E
I
NT
DE
FI
ON
N/A
A6
ON SHT 3 IN TOP L.H.VIEW EXTERNAL SHIELD
CONNECTIONS WERE IN 8 OR 16 POSITIONS.
2.0 DIMENSION WAS 1.95;1.0 WAS 0.98
06/12/2006
F
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
C
2
3
Drawn
Date
All dimensions
in mm
Do Not Scale
Scale
20 : 1
F
19 APR 06
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
NY
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
SEE TABLE
6
Part No.
7981529
Title
555 CAMERA MODULE
Sheet
1 OF 3
OUTLINE DRAWING
C
PA
OM
1
7
8
3/7
'F' AT DATUM 'A'
4/7
2
REV
A
Figure 4.
1
6
TOP OF
SCENE
A
3
4
7
8
5
A
B
B
Module outline drawing (2/3)
PYRAMID
SEE TABLE DIM 'B'
DIA 'D'
MEASURED
AT DATUM 'A'
CONE
SEE TABLE DIM 'A'
PYRAMID
SEE TABLE DIM'C'
D
A
'E' AT DATUM 'A'
C
C
D
E
1.28mm
D
CONE DIA
AT 'A'
HORIZONTAL
FOV AT 'A'
VERTICAL
FOV AT 'A'
E
F
1.02mm
0.77mm
84.4
71.6
56.6
E
A
B
C
CONE FULL HORIZONTAL
FULL ANGLE
ANGLE
Interpret drawing per BS8888, 3RD Angle Projection Material
VERTICAL
FULL
ANGLE
Tolerances, unless otherwise stated
All dimensions in mm
Drawn
Date
Finish
F
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
All dimensions
in mm
Do Not Scale
Scale
10 : 1
F
19 APR 06
Part No.
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
7981529
6
Title
555 CAMERA MODULE
Sheet
2 OF 3
OUTLINE DRAWING
VS6555
1
2
3
7
8
VS6555
Figure 5.
1
2
REV
A
3
4
6
TOP OF
SCENE
PIN 1
MARKER
A
7
8
EXTERNAL EMC SHIELD
CONNECTIONS
IN 16 OR 24 POSITIONS
T.B.D.
5
3.90
PIN 1
2.00
A
2.00
3.90
B
4.90
3.60
0.45 TYP.
0.90 TYP.
0.55 TYP.
1.375
0.25
IN 24 POSITIONS
1.95
1.00
B
Module outline drawing (3/3)
1.00
1.95
1.075
C
C
VIEW ON REAR
OF MODULE
PIN OUT
6
0.80
0.40
PIN 13
PIN 14
PIN 15
PIN 16
PIN 17
PIN 18
PIN 19
PIN 20
PIN 21
PIN 22
PIN 23
PIN 24
Interpret drawing per BS8888, 3RD Angle Projection Material
All dimensions in mm
Date
Finish
PIN 1
XSHUTDOWN
SCL
EMC GND
AGND
PIN 2
DATAN
3.60
PIN 6
EMC GND
VCAP
GND
EXTCLK
DGND
EMC GND
EMC GND
CAP1V2
PIN 7
GND
E
PIN 8
VANA
1.20 TYP.
24
19
0.65 TYP.
PIN 5
CLKN
NC
0.975
PIN 4
CLKP
SDA
4.90
0.40
0.80
REFERENCE PWB PAD LAYOUT
VIEWED FROM ABOVE PWB.
Drawn
All dimensions
in mm
Do Not Scale
Scale
15 : 1
D
PIN 3
GND
1.475
1
CONNECTION TABLE
D
PIN 9
DATAP
E
0.15 TYP.
0.50 TYP.
PIN 10
VDIG
PIN 11
NC
PIN 12
GND
Tolerances, unless otherwise stated
F
This drawing is the property of STMicroelectronics
and will not be copied or loaned without the
written permission of STMicroelectronics.
F
19 APR 06
Part No.
STMicroelectronics
Home, Personal & Communication Sector
Imaging Division
Linear
0 Place Decimals 0
±0.05
1 Place Decimals 0.0 ±0.05
2 Place Decimals 0.00 ±0.05
Angular
±0.25 degrees
Diameter
+0.05
Position
0.10
Surface Finish 1.6 microns
7981529
6
Title
555 CAMERA MODULE
Sheet
3 OF 3
OUTLINE DRAWING
1
2
3
7
8
5/7
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