PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, SOP36,.4,32 |
| 针数 | 36 |
| 制造商包装代码 | GW |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输出电压 | 12.6 V |
| 最小模拟输出电压 | -12.6 V |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD |
| JESD-30 代码 | R-PDSO-G36 |
| JESD-609代码 | e0 |
| 长度 | 15.4 mm |
| 最大线性误差 (EL) | 0.0031% |
| 湿度敏感等级 | 1 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 36 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SOP36,.4,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 标称安定时间 (tstl) | 2 µs |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 7.5 mm |
| LTC1821-1BCGW | LTC1821-1ACGW | LTC1821-1AIGW | LTC1821-1BIGW | LTC1821ACGW | HM2505C | LTC1821BCGW | LTC1821BIGW | |
|---|---|---|---|---|---|---|---|---|
| 描述 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | Single channel 3.0-15.0V peak 15.0A H-bridge driver chip | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 | PARALLEL, WORD INPUT LOADING, 2 us SETTLING TIME, 16-BIT DAC, PDSO36 |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | - | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | SSOP | SSOP | SSOP | SSOP | SSOP | - | SSOP | SSOP |
| 包装说明 | SSOP, SOP36,.4,32 | SSOP, SOP36,.4,32 | SSOP, SOP36,.4,32 | SSOP, SOP36,.4,32 | SSOP, SOP36,.4,32 | - | SSOP, SOP36,.4,32 | SSOP, SOP36,.4,32 |
| 针数 | 36 | 36 | 36 | 36 | 36 | - | 36 | 36 |
| 制造商包装代码 | GW | GW | GW | GW | GW | - | GW | GW |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | _compli | - | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| 最大模拟输出电压 | 12.6 V | 12.6 V | 12.6 V | 12.6 V | 12.6 V | - | 12.6 V | 12.6 V |
| 最小模拟输出电压 | -12.6 V | -12.6 V | -12.6 V | -12.6 V | -12.6 V | - | -12.6 V | -12.6 V |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | - | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输入格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 代码 | R-PDSO-G36 | R-PDSO-G36 | R-PDSO-G36 | R-PDSO-G36 | R-PDSO-G36 | - | R-PDSO-G36 | R-PDSO-G36 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 长度 | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | 15.4 mm | - | 15.4 mm | 15.4 mm |
| 最大线性误差 (EL) | 0.0031% | 0.0015% | 0.0015% | 0.0031% | 0.0015% | - | 0.0031% | 0.0031% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 位数 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 36 | 36 | 36 | 36 | 36 | - | 36 | 36 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | - | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | SSOP | SSOP | - | SSOP | SSOP |
| 封装等效代码 | SOP36,.4,32 | SOP36,.4,32 | SOP36,.4,32 | SOP36,.4,32 | SOP36,.4,32 | - | SOP36,.4,32 | SOP36,.4,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | 235 | 235 | - | 235 | 235 |
| 电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | - | 5,+-15 V | 5,+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | - | 2.65 mm | 2.65 mm |
| 标称安定时间 (tstl) | 2 µs | 2 µs | 2 µs | 2 µs | 2 µs | - | 2 µs | 2 µs |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | - | 20 | 20 |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | - | 7.5 mm | 7.5 mm |
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