IC HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, Bus Driver/Transceiver
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | BROADSIDE VERSION OF 374 |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T20 |
| 长度 | 26.73 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 50 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 74HCT574NB | 74HCT574D/T3 | 74HC574D/T3 | 74HC574NB | |
|---|---|---|---|---|
| 描述 | IC HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, Bus Driver/Transceiver | IC HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SOP-20, Bus Driver/Transceiver | IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SOP-20, Bus Driver/Transceiver | IC HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, Bus Driver/Transceiver |
| 包装说明 | DIP, | SOP, | SOP, | DIP, |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| 其他特性 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 |
| 系列 | HCT | HCT | HC/UH | HC/UH |
| JESD-30 代码 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
| 长度 | 26.73 mm | 12.8 mm | 12.8 mm | 26.73 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 传播延迟（tpd） | 50 ns | 50 ns | 45 ns | 45 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.2 mm | 2.65 mm | 2.65 mm | 4.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
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