16-BIT, 66.67 MHz, OTHER DSP, PBGA136
16位, 66.67 MHz, 其它数字信号处理器, PBGA136
参数名称 | 属性值 |
外部数据总线宽度 | 16 |
端子数量 | 136 |
最小工作温度 | 0.0 Cel |
最大工作温度 | 70 Cel |
加工封装描述 | MO-205AE, BGA-136 |
each_compli | Yes |
状态 | Active |
microprocessor_microcontroller_peripheral_ic_type | DIGITAL SIGNAL PROCESSOR, OTHER |
地址总线宽度 | 16 |
桶形移位器 | YES |
位数 | 32 |
边界扫描 | YES |
clock_frequency_max | 66.67 MHz |
form | FLOATING POINT |
内部总线架构 | MULTIPLE |
jesd_30_code | S-PBGA-B136 |
jesd_609_code | e0 |
低功耗模式 | NO |
moisture_sensitivity_level | 3 |
包装材料 | PLASTIC/EPOXY |
ckage_code | LFBGA |
ckage_equivalence_code | BGA136,14X14,32 |
包装形状 | SQUARE |
包装尺寸 | GRID ARRAY, LOW PROFILE, FINE PITCH |
eak_reflow_temperature__cel_ | 240 |
wer_supplies | 1.2,3.3 |
qualification_status | COMMERCIAL |
m__words_ | 65536 |
seated_height_max | 1.7 mm |
sub_category | Digital Signal Processors |
额定供电电压 | 1.2 V |
最小供电电压 | 1.14 V |
最大供电电压 | 1.26 V |
表面贴装 | YES |
工艺 | CMOS |
温度等级 | COMMERCIAL |
端子涂层 | TIN LEAD SILVER |
端子形式 | BALL |
端子间距 | 0.8000 mm |
端子位置 | BOTTOM |
ime_peak_reflow_temperature_max__s_ | 30 |
length | 12 mm |
width | 12 mm |
ADSP-21262 | ADSP-21262_05 | |
---|---|---|
描述 | 16-BIT, 66.67 MHz, OTHER DSP, PBGA136 | 16-BIT, 66.67 MHz, OTHER DSP, PBGA136 |
外部数据总线宽度 | 16 | 16 |
端子数量 | 136 | 136 |
最小工作温度 | 0.0 Cel | 0.0 Cel |
最大工作温度 | 70 Cel | 70 Cel |
加工封装描述 | MO-205AE, BGA-136 | MO-205AE, BGA-136 |
each_compli | Yes | Yes |
状态 | Active | Active |
microprocessor_microcontroller_peripheral_ic_type | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
地址总线宽度 | 16 | 16 |
桶形移位器 | YES | YES |
位数 | 32 | 32 |
边界扫描 | YES | YES |
clock_frequency_max | 66.67 MHz | 66.67 MHz |
form | FLOATING POINT | FLOATING POINT |
内部总线架构 | MULTIPLE | MULTIPLE |
jesd_30_code | S-PBGA-B136 | S-PBGA-B136 |
jesd_609_code | e0 | e0 |
低功耗模式 | NO | NO |
moisture_sensitivity_level | 3 | 3 |
包装材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
ckage_code | LFBGA | LFBGA |
ckage_equivalence_code | BGA136,14X14,32 | BGA136,14X14,32 |
包装形状 | SQUARE | SQUARE |
包装尺寸 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
eak_reflow_temperature__cel_ | 240 | 240 |
wer_supplies | 1.2,3.3 | 1.2,3.3 |
qualification_status | COMMERCIAL | COMMERCIAL |
m__words_ | 65536 | 65536 |
seated_height_max | 1.7 mm | 1.7 mm |
sub_category | Digital Signal Processors | Digital Signal Processors |
额定供电电压 | 1.2 V | 1.2 V |
最小供电电压 | 1.14 V | 1.14 V |
最大供电电压 | 1.26 V | 1.26 V |
表面贴装 | YES | YES |
工艺 | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL |
端子涂层 | TIN LEAD SILVER | TIN LEAD SILVER |
端子形式 | BALL | BALL |
端子间距 | 0.8000 mm | 0.8000 mm |
端子位置 | BOTTOM | BOTTOM |
ime_peak_reflow_temperature_max__s_ | 30 | 30 |
length | 12 mm | 12 mm |
width | 12 mm | 12 mm |
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