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MA4P7464F-1072T

产品描述Pin Diode, 400V V(BR), Silicon, ROHS COMPLIANT, CERAMIC, CASE 1072, 2 PIN
产品类别二极管    PIN 二极管   
文件大小135KB,共6页
制造商MACOM
官网地址http://www.macom.com
标准  
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MA4P7464F-1072T概述

Pin Diode, 400V V(BR), Silicon, ROHS COMPLIANT, CERAMIC, CASE 1072, 2 PIN

MA4P7464F-1072T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称MACOM
包装说明R-CELF-N2
针数2
制造商包装代码CASE 1072
Reach Compliance Codecompliant
其他特性LOW DISTORTION
应用SWITCHING
最小击穿电压400 V
外壳连接ISOLATED
配置SINGLE
最大二极管电容0.8 pF
标称二极管电容0.8 pF
二极管元件材料SILICON
最大二极管正向电阻0.6 Ω
二极管电阻测试电流100 mA
二极管电阻测试频率100 MHz
二极管类型PIN DIODE
频带HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 代码R-CELF-N2
少数载流子标称寿命4.5 µs
元件数量1
端子数量2
最高工作温度175 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
最大功率耗散2.5 W
认证状态Not Qualified
反向测试电压100 V
表面贴装YES
技术POSITIVE-INTRINSIC-NEGATIVE
端子形式NO LEAD
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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Non Magnetic SMQ HIPAX
PIN Diode
V 1.00
MA4P7464F-1072T
Features
Non-Magnetic Package Suitable for MRI Applications
Rectangular MELF SMQ Ceramic Package
Hermetically Sealed
Lower Rs for Lower Series Loss
n
Longer
τ
L
for Lower Intermodulation Distortion
n
Lower Cj for Higher Series Isolation
n
Higher Average Incident Power Handling Capability
n
n
n
n
Description
The MA4P7464F-1072T is a surface mountable PIN diode
in a Non-Magnetic ( patent pending ) Metal Electrode
Leadless Faced (MELF) package. The device incorporates
M/A-COM’s proven HIPAX technology to produce a low
inductance ceramic package with no ribbons or whisker
wires. The package utilizes M/A-COM’s new non-
magnetic plating process to provide an extremely low
permeability, hermetically sealed package. Incorporated in
the package is a passivated PIN diode that is full face
bonded on both the cathode and anode of the chip to
maximize surface area for lower electrical and thermal
resistance. The MA4P7464F-1072T has been
comprehensively characterized both electrically and
mechanically to ensure repeatable and predictable
performance.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high volume tape
and reel assembly. The rectangular package design provides
for highly efficient automatic pick and place assembly
techniques. The parallel flat surfaces are suitable for key
jaw or vacuum pickup techniques. All solder able surfaces
are tin plated and compatible with reflow and vapor phase
soldering methods.
Enviornmental Capability
HIPAX devices are applicable for use in industrial and
military applications and can be screened to meet the
environmental requirements of MIL-STD-750, MIL-STD-202 as
well as other military standards. The table below lists some
of the MIL-STD 750 tests the device is designed to meet.
Applications
The diodes are well suited for use in low loss, low
distortion, and high power switching circuits applicable for
high magnetic field environments from HF through UHF
frequencies. The lower thermal resistance of this device
provides excellent higher average performance at RF power
incident levels up to 100 watts CW. This device is designed
to meet the most rigorous electrical and mechanical
requirements of MRI testing environments.
MIL-STD-750
Test
High Temperature Storage
Temperature Shock
HTRB
Moisture Resistance
Gross Leak
Vibration Fatigue
Solderability
1031
1051
1038
1021
1071 Cond. E
2046
2026
Method
Description
+150 °C, 340 Hours
-65 °C to +125 °C, 20 Cycles
80% of rated V
B
, +150 °C, for 96 Hours
No Initial Conditioning, 85 % RH, +85° C
Dye Penetrant Visual
20,000 G’s, 60 Hz, x, y, z axis
Test Temperature = +245 °C
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