UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, JLCC-32
| 参数名称 | 属性值 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | QFJ |
| 包装说明 | WQCCJ, |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| JESD-30 代码 | R-CQCC-J32 |
| JESD-609代码 | e0 |
| 长度 | 14.1 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 32KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.24 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.55 mm |
| Base Number Matches | 1 |
| 5962-8606302ZA | 5962-8606302YA | 5962-8606303ZX | AT27C256R-25KC | AT27C256R-25LC | AT27C256R-20JCT/R | AT27C256R-25RCT/R | |
|---|---|---|---|---|---|---|---|
| 描述 | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, JLCC-32 | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 32KX8, CMOS, CQCC32, LCC-32 | UVPROM, 32KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | UVPROM, 32KX8, 250ns, CMOS, CQCC32, CERAMIC, LCC-32 | OTP ROM, 32KX8, 200ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 32KX8, 250ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 包装说明 | WQCCJ, | WQCCN, | WQCCJ, | WQCCJ, LDCC32,.5X.6 | QCCN, LCC32,.45X.55 | QCCJ, | SOP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant | compliant |
| JESD-30 代码 | R-CQCC-J32 | R-CQCC-N32 | R-CQCC-J32 | R-CQCC-J32 | R-CQCC-N32 | R-PQCC-J32 | R-PDSO-G28 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 28 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | WQCCJ | WQCCN | WQCCJ | WQCCJ | QCCN | QCCJ | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | NO LEAD | J BEND | J BEND | NO LEAD | J BEND | GULL WING |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 零件包装代码 | QFJ | QFJ | - | QFJ | QFJ | QFJ | SOIC |
| 针数 | 32 | 32 | - | 32 | 32 | 32 | 28 |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 250 ns | 250 ns | - | 250 ns | 250 ns | 200 ns | 250 ns |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 长度 | 14.1 mm | 13.95 mm | - | 14.1 mm | 13.97 mm | 13.97 mm | 18.25 mm |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 座面最大高度 | 4.24 mm | 2.92 mm | - | 4.24 mm | 2.54 mm | 3.55 mm | 2.79 mm |
| 端子面层 | TIN LEAD | TIN LEAD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 宽度 | 11.55 mm | 11.4 mm | - | 11.55 mm | 11.43 mm | 11.43 mm | 8.74 mm |
| Is Samacsys | - | - | N | N | N | N | N |
| 是否无铅 | - | - | - | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 峰值回流温度（摄氏度） | - | - | - | 225 | 240 | 225 | 225 |
| 处于峰值回流温度下的最长时间 | - | - | - | NOT SPECIFIED | 30 | 30 | 30 |
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