IC HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOT-402-1, TSSOP-14, Gate
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | INVERTER |
| 湿度敏感等级 | 1 |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 190 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74HC14PW-T | 74HCT14PW-T | 74HC14DB,118 | 74HC14N/S212,112 | 74HC14N/S242,112 | 74HCT14D/S206,118 | 74HCT14D/S242,118 | 74HC14D/S242,118 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOT-402-1, TSSOP-14, Gate | IC HCT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, SOT-402-1, TSSOP-14, Gate | 74HC(T)14 - Hex inverting Schmitt trigger SSOP1 14-Pin | IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,14PIN,PLASTIC | Hex inverting Schmitt trigger, SOT27-1 Package, Standard Marking, IC'S Tube - DSC Bulk Pack | IC IC,LOGIC GATE,HEX INVERTER,HCT-CMOS,SOP,14PIN,PLASTIC, Gate | Hex inverting Schmitt trigger, SOT108-1 Package, Standard Marking, Reel Pack, SMD, 13" | Hex inverting Schmitt trigger, SOT108-1 Package, Standard Marking, Reel Pack, SMD, 13" |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | unknown | unknow |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | AND GATE | INVERTER | AND GATE | INVERTER | INVERTER |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SSOP | DIP | DIP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Source Url Status Check Date | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | - | 2013-10-15 00:00:00 | - | 2013-10-15 00:00:00 | 2013-10-15 00:00:00 |
| 包装说明 | TSSOP, | TSSOP, | SSOP, SSOP14,.3 | - | - | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 |
| JESD-609代码 | e4 | e4 | e4 | e3 | - | e3 | - | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | - | 5 V | 5 V | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Matte Tin (Sn) | - | Matte Tin (Sn) | - | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | - | NOT SPECIFIED | - | - |
| 最大I（ol） | - | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 封装等效代码 | - | - | SSOP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | SOP14,.25 |
| 包装方法 | - | - | TAPE AND REEL | TUBE | TUBE | TAPE AND REEL | TAPE AND REEL | TR |
| 电源 | - | - | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 2/6 V |
| Prop。Delay @ Nom-Sup | - | - | 38 ns | 38 ns | 38 ns | 51 ns | 51 ns | - |
| 施密特触发器 | - | - | YES | YES | YES | YES | YES | YES |
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