Product
Specification
108-40012
11 Mar 11 Rev A
AMPLIMITE* HDF-20 Low Profile Connector
1.
1.1.
SCOPE
Content
This specification covers the performance, tests and quality requirements for AMPLIMITE* HDF-20 Low
Profile (90° Cable Exit) connector, with non-remova ble insulation displacement contacts for mass
termination of .050 centerline #26 and 28 AWG solid and #26 and 28 AWG stranded round conductor
planar ribbon cable. Connector varieties include an all plastic version as well as one with a front metal
shell.
1.2.
Qualification
When tests are performed on the subject product line, the procedures specified in 109-Series Test
Specifications shall be used. All inspections shall be performed using the applicable inspection plan
and product drawing.
2.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. In the event of
conflict between the requirements of this specification and the product drawing, the product drawing
shall take precedence. In the event of conflict between the requirements of this specification and the
referenced documents, this specification shall take precedence.
2.1.
TE Connectivity (TE) Documents
A.
B.
C.
D.
109-1:
109 Series:
114-40005:
501-129 :
General Requirements for Test Specifications
Test Specifications as indicated in Figure 1.
Application Specification
Test Report
3.
3.1.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable
product drawing.
3.2.
Material
A.
B.
C.
Contact: Phosphor bronze
Housing: Thermoplastic, UL94V-0
Shell:
Steel
3.3.
Ratings
A.
B.
C.
Voltage: 30 vac rms per CSA; 250 vac rms per UL
Current: 1.25 amperes maximum
Temperature:
-55° to 105°
C
3.4.
Performance and Test Description
The product is designed to meet the electrical, mechanical and environmental performance
requirements specified in Figure 1. All tests are performed at ambient temperature unless otherwise
specified.
©2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. Company
All Rights Reserved
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1 of 8
LOC B
108-40012
3.5.
Test Requirements and Procedures Summary
Requirement
Meets requirements of
product drawing and Application
Specification 114-40005.
ELECTRICAL
25 milliohms maximum.
Procedure
Visual, dimensional and functional
per applicable quality inspection
plan.
Subject mated contacts assembled
in housing to 50 mv open circuit at
100 ma maximum, see Figure 4;
Test Specification 109-6-1.
Test between adjacent contacts of
unmated connector, contacts and
adjacent conductor, and contacts
to metal shell;
Test Specification 109-29-1.
Test between adjacent contacts of
unmated connector:
Test Specification 109-28-4.
Measure temperature rise vs
current with all circuits energized;
Test Specification 109-45-1.
Test Description
Examination of Product
Termination Resistance,
Dry Circuit
Dielectric Withstanding Voltage
Insulation Resistance
500 vac dielectric withstanding
voltage, one minute hold. 1
milliampere maximum leakage
current. No breakdown or
flashover.
5000 megohms minimum initial,
1000 megohms final.
Maximum temperature rise at
specified current, 30° C. At
maximum ambient of 70°
C
reference Para 3.3.B
MECHANICAL
No discontinuities greater than 1
microsecond. See Note.
Temperature Rise vs Current
Vibration, Random
Physical Shock
No discontinuities greater than 1
microsecond. See Note.
Mating Force
Maximum force pounds.
With
No. of
Ground
Contacts
Indents
9
30
15
33
25
37
37
40
50
45
Without
Ground
Indents
4.5
7.5
12.5
18.5
25.0
Subject mated connector with
hardware to 16.4 G rms with 100
ma current applied, refer to Figure
5; Test Specification 109-21-5,
Figure 3, test level E, 20 minutes
duration in each of 3 mutually
perpendicular planes.
Subject mated connectors with
hardware to 50 G's half-sine shock
pulses of 11 milliseconds duration;
3 shocks in each direction applied
along the 3 mutually perpendicular
planes total 18 shocks; Test
Specification 109-26-1.
Measure force necessary to mate
connector assembly, a distance of
.140 from point of initial contact
incorporating free floating fixture at
a rate of .5 inch/minute; Test
Specification 109-42. cond A.
Figure 1 (continued)
Rev A
2 of 8
108-40012
Test Description
Unmating Force
Durability
Thermal Shock
Requirement
Force, pounds
With
Without
No. of
Ground
Ground
Contacts
Indents
Indents
9
30
0.5
15
33
0.9
25
37
2.5
37
40
2.5
50
45
---
See Note.
Gold Plating
Thickness
Durability
Microinches
Cycles
15
100
30
500
ENVIORNMENTAL
See Note.
Procedure
Measure force necessary to
unmate connector assembly,
incorporating free floating fixtures
at a rate of .5 inch/minute; test
Specification 109-42, cond. A.
Mate and unmate connector
assemblies for indicated number of
cycles at a maximum rate of 200
cycles/hours; Test Specification
109-27.
Humidity-Temperature Cycling
See Note.
Industrial Mixed Flow Gas
See Note.
Temperature Life
See Note.
Subject unmated connector to 5
cycles between -55øand 105øC;
Test Specification 109-22.
Subject mated connectors to 10
humidity-temperature cycles
between 25° and 65°C at 95% RH;
Test Specification 109-23, method
III, cond B. With cold shock at -
10øC less step 7b. Measurement
shall be made within 5 hours of
removal from chamber.
Precondition connectors to 10
durability cycles. Subject mated
connectors to environmental class
III for 20 days; Test Specification
109-85-3.
Subject mated connectors to
temperature life; Test Specification
109-43, test level 10, duration C.
3.6.
NOTE
Shall remain mated and show no evidence of damage, cracking or chipping and
meet requirements of subsequent testing.
Figure 1 (end)
Rev A
3 of 8
108-40012
Test or Examination
Examination of Product
Termination Resistance, Dry Circuit
Dielectric Withstanding Voltage
Insulation Resistance
Temperature Rise vs Current
Vibration
Physical Shock
Mating Force
Unmating Force
Durability
Thermal Shock
Humidity-Temperature Cycling
Industrial Mixed Flowing Gas
Temperature Life
NOTE
1
1, 9
3, 7
2
1, 6
2, 5
Test Group (a)
3
4 (b)
5
Test Sequence (c)
1, 6
1, 5
1, 5
2, 5
2, 4
2, 4
6 (d)
1, 8
3, 7
2, 6
7
1, 6
3
5
6
2
8
4
3
3
4
3
4
5
2
3, 5
4
4
(a) See Para 4.1.A
(b) Discontinuities shall not be measured for this test group
(c) Numbers indicate sequence in which tests are performed
(d) Test group 6 humidity-temperature cycling is to be conducted unmated
Figure 2
3.6.
Retention of Qualification Tests
Test Group (a)
1
2
Test Sequence (b)
1, 8
1, 8
3, 7
3, 7
2, 6
2
6
4
4
5
5
Test or Examination
Examination of Product
Termination Resistance, Dry Circuit
Dielectric Withstanding Voltage
Insulation Resistance
Mating Force
Unmating Force
Durability
Thermal Shock
Humidity-Temperature Cycling
NOTE
(a) See Para 4.1.A
(b) Numbers indicate sequence in which tests are performed.
Figure 3
Rev A
4 of 8
108-40012
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Sample Selection
Connector assemblies shall be prepared in accordance with applicable Instruction Sheets. They
shall be selected at random from current production per Figure 6. Hardware where indicated shall
be female screwlock kit 205817-1 and screw retainer kit 746881-1 for connector sizes 1 through 4.
Connector size 5 shall utilize slide latch 745577-1 with screw 206943-5 and locking post 206514-
1.
B.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
4.2.
Retention of Qualification
If, in a five-year period, no changes to the product or process occur, the product shall be subjected to
the two groups of the testing described in the test sequence, see Figure 3. Justification for exceeding
this time limit must be documented and approved by the division manager.
4.3.
Requalification Testing
If changes significantly affecting form, fit, or function are made to the product or to the manufacturing
process, product assurance shall coordinate requalification testing, consisting of all or part of the
original testing sequence as determined by development/product, quality, and reliability engineering.
4.4.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup, or operator deficiencies shall not disqualify the product. When
product failure occurs, corrective action shall be taken and samples resubmitted for qualification.
Testing to confirm corrective action is required before resubmittal.
4.5.
Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Rev A
5 of 8
FPGA/CPLD
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