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74ABT16500BDGGRG4

产品描述Registered Bus Transceiver, ABT Series, 1-Func, 18-Bit, True Output, BICMOS, PDSO56, TSSOP-56
产品类别逻辑    逻辑   
文件大小329KB,共11页
制造商Rochester Electronics
官网地址https://www.rocelec.com/
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74ABT16500BDGGRG4概述

Registered Bus Transceiver, ABT Series, 1-Func, 18-Bit, True Output, BICMOS, PDSO56, TSSOP-56

74ABT16500BDGGRG4规格参数

参数名称属性值
厂商名称Rochester Electronics
包装说明TSSOP,
Reach Compliance Codeunknown
系列ABT
JESD-30 代码R-PDSO-G56
长度14 mm
逻辑集成电路类型REGISTERED BUS TRANSCEIVER
位数18
功能数量1
端口数量2
端子数量56
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd)5 ns
座面最大高度1.2 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
宽度6.1 mm
Base Number Matches1

文档预览

下载PDF文档
SN54ABT16500B, SN74ABT16500B
18-BIT UNIVERSAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS057G – DECEMBER 1990 – REVISED MAY 1997
D
D
D
D
D
D
D
D
D
Members of the Texas Instruments
Widebus
Family
State-of-the-Art
EPIC-
ΙΙ
B
BiCMOS Design
Significantly Reduces Power Dissipation
UBT
(Universal Bus Transceiver)
Combines D-Type Latches and D-Type
Flip-Flops for Operation in Transparent,
Latched, or Clocked Mode
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 5 V, T
A
= 25°C
High-Impedance State During Power Up
and Power Down
Flow-Through Architecture Optimizes PCB
Layout
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
SN54ABT16500B . . . WD PACKAGE
SN74ABT16500B . . . DGG OR DL PACKAGE
(TOP VIEW)
description
These 18-bit universal bus transceivers combine
D-type latches and D-type flip-flops to allow data
flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by
output-enable (OEAB and OEBA), latch-enable
(LEAB and LEBA), and clock (CLKAB and
CLKBA) inputs. For A-to-B data flow, the device
operates in the transparent mode when LEAB is
high. When LEAB is low, the A data is latched if
CLKAB is held at a high or low logic level. If LEAB
is low, the A data is stored in the latch/flip-flop on
the high-to-low transition of CLKAB. OEAB is
active-high. When OEAB is high, the outputs are
active. When OEAB is low, the outputs are in the
high-impedance state.
OEAB
LEAB
A1
GND
A2
A3
V
CC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
V
CC
A16
A17
GND
A18
OEBA
LEBA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GND
CLKAB
B1
GND
B2
B3
V
CC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
V
CC
B16
B17
GND
B18
CLKBA
GND
Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are
complementary (OEAB is active high and OEBA is active low).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC-ΙΙB, and UBT are trademarks of Texas Instruments Incorporated.
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
Copyright
©
1997, Texas Instruments Incorporated
DALLAS, TEXAS 75265
1

74ABT16500BDGGRG4相似产品对比

74ABT16500BDGGRG4
描述 Registered Bus Transceiver, ABT Series, 1-Func, 18-Bit, True Output, BICMOS, PDSO56, TSSOP-56
厂商名称 Rochester Electronics
包装说明 TSSOP,
Reach Compliance Code unknown
系列 ABT
JESD-30 代码 R-PDSO-G56
长度 14 mm
逻辑集成电路类型 REGISTERED BUS TRANSCEIVER
位数 18
功能数量 1
端口数量 2
端子数量 56
最高工作温度 85 °C
最低工作温度 -40 °C
输出特性 3-STATE
输出极性 TRUE
封装主体材料 PLASTIC/EPOXY
封装代码 TSSOP
封装形状 RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd) 5 ns
座面最大高度 1.2 mm
最大供电电压 (Vsup) 5.5 V
最小供电电压 (Vsup) 4.5 V
标称供电电压 (Vsup) 5 V
表面贴装 YES
技术 BICMOS
温度等级 INDUSTRIAL
端子形式 GULL WING
端子节距 0.5 mm
端子位置 DUAL
宽度 6.1 mm
Base Number Matches 1

 
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