8K X 8 SPI BUS SERIAL EEPROM, PDSO8
8K × 8 总线串行电可擦除只读存储器, PDSO8
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最大工作温度 | 85 Cel |
| 最小工作温度 | -40 Cel |
| 最大供电/工作电压 | 5.5 V |
| 最小供电/工作电压 | 1.8 V |
| 额定供电电压 | 2.5 V |
| 最大时钟频率 | 10 MHz |
| 加工封装描述 | GREEN, MO-153, TSSOP-8 |
| 无铅 | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | TRANSFERRED |
| 工艺 | CMOS |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | INDUSTRIAL |
| 内存宽度 | 8 |
| 组织 | 8K X 8 |
| 存储密度 | 65536 deg |
| 操作模式 | SYNCHRONOUS |
| 位数 | 8192 words |
| 位数 | 8K |
| 内存IC类型 | SPI BUS SERIAL EEPROM |
| 串行并行 | SERIAL |
| 写周期最大TWC | 5 ms |
| CAT25640 | CAT25640VIT3 | CAT25640YIT3 | CAT25640LIT3 | CAT25640YI-GT3 | CAT25640VP2IT3 | CAT25640VP2I-GT3 | CAT25640VI-GT3 | CAT25640LI-GT3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 8K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | THROUGH-孔 |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | 双 |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 组织 | 8K X 8 | 8KX8 | 8KX8 | 8K X 8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8K × 8 |
| 表面贴装 | Yes | YES | YES | Yes | YES | YES | YES | YES | - |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | - | Catalyst | Catalyst | - | Catalyst | Catalyst | - | Catalyst | - |
| 零件包装代码 | - | SOIC | TSSOP | - | TSSOP | SON | SON | SOIC | - |
| 包装说明 | - | 0.150 INCH, GREEN, MS-012, SOIC-8 | GREEN, MO-153, TSSOP-8 | - | GREEN, MO-153, TSSOP-8 | 2 X 3 MM, GREEN, MO-229, TDFN-8 | 2 X 3 MM, GREEN, MO-229, TDFN-8 | 0.150 INCH, GREEN, MS-012, SOIC-8 | - |
| 针数 | - | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | - | unknow | unknow | - | unknow | unknow | unknow | unknow | - |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大时钟频率 (fCLK) | - | 10 MHz | 10 MHz | - | 10 MHz | 10 MHz | 10 MHz | 10 MHz | - |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-XDSO-N8 | R-XDSO-N8 | R-PDSO-G8 | - |
| JESD-609代码 | - | e3 | e3 | - | e4 | e3 | e4 | e4 | - |
| 长度 | - | 4.9 mm | 4.4 mm | - | 4.4 mm | 3 mm | 3 mm | 4.9 mm | - |
| 内存密度 | - | 65536 bi | 65536 bi | - | 65536 bi | 65536 bi | 65536 bi | 65536 bi | - |
| 内存集成电路类型 | - | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM | - |
| 字数 | - | 8192 words | 8192 words | - | 8192 words | 8192 words | 8192 words | 8192 words | - |
| 字数代码 | - | 8000 | 8000 | - | 8000 | 8000 | 8000 | 8000 | - |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | - |
| 封装代码 | - | SOP | TSSOP | - | TSSOP | HVSON | HVSON | SOP | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - |
| 并行/串行 | - | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | - | 260 | 260 | 260 | 260 | - |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 1.75 mm | 1.2 mm | - | 1.2 mm | 0.8 mm | 0.8 mm | 1.75 mm | - |
| 串行总线类型 | - | SPI | SPI | - | SPI | SPI | SPI | SPI | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子节距 | - | 1.27 mm | 0.65 mm | - | 0.65 mm | 0.5 mm | 0.5 mm | 1.27 mm | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | - | 40 | 40 | 40 | 40 | - |
| 宽度 | - | 3.9 mm | 3 mm | - | 3 mm | 2 mm | 2 mm | 3.9 mm | - |
| 最长写入周期时间 (tWC) | - | 5 ms | 5 ms | - | 5 ms | 5 ms | 5 ms | 5 ms | - |
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