800SM Series
A
Surface Mount DIP Sockets
814-AG11SM
FEATURES:
Augat offers the precision machined 800SM Series which achieves
compliancy to the board surface and is designed for high temperatures
typical of vapor phase and infrared reflow soldering.
• “Butt” style terminals float in plastic housing for compliancy
to board surface
• Precision four-fingered inner contacts provide concentric funnel entry
for easy flat or round insertion
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G's
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Inner Contact
Retention ................ 7.5 Lbs. per line average
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Outer Sleeve .................. Brass
Contacts .......................... Beryllium copper
Sleeve Plating ................ Tin/lead
Contact Plating .............. Gold or tin/lead
Quality & Innovation From The
Product Group
A16
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
FPGA/CPLD
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