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CY7C1353F

产品描述4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture
文件大小321KB,共13页
制造商Cypress(赛普拉斯)
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CY7C1353F概述

4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture

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CY7C1353F
4-Mb (256K x 18) Flow-through SRAM with NoBL™ Architecture
Features
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 256K x 18 common I/O architecture
• 2.5V / 3.3V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
— 8.0 ns (for 100-MHz device)
— 11.0 ns (for 66-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• JEDEC-standard 100 TQFP package
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1353F is a 3.3V, 256K x 18 Synchronous
Flow-through Burst SRAM designed specifically to support
unlimited true back-to-back Read/Write operations without the
insertion of wait states. The CY7C1353F is equipped with the
advanced No Bus Latency™ (NoBL™) logic required to
enable consecutive Read/Write operations with data being
transferred on every clock cycle. This feature dramatically
improves the throughput of data through the SRAM, especially
in systems that require frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two Byte Write Select
(BW
[A:B]
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output three-state control. In order to avoid bus
contention, the output drivers are synchronously three-stated
during the data portion of a write sequence.
Logic Block Diagram
A0, A1, A
MODE
CLK
CEN
C
CE
ADV/LD
C
WRITE ADDRESS
REGISTER
ADDRESS
REGISTER
A1
D1
A0
D0
Q1 A1'
A0'
Q0
BURST
LOGIC
ADV/LD
BW
A
BW
B
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
A
DQP
B
WE
OE
CE
1
CE
2
CE
3
ZZ
1
INPUT
REGISTER
READ LOGIC
E
SLEEP
CONTROL
Note:
1. For best–practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05212 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised January 13, 2004

CY7C1353F相似产品对比

CY7C1353F CY7C1353F-100AI CY7C1353F-117AC CY7C1353F-117AI CY7C1353F-133AC CY7C1353F-66AC CY7C1353F-66AI
描述 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture 4-Mb (256K x 18) Flow-through SRAM with NoBL Architecture
是否Rohs认证 - 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 - Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
零件包装代码 - QFP QFP QFP QFP QFP QFP
包装说明 - 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数 - 100 100 100 100 100 100
Reach Compliance Code - compliant compliant compliant compliant compliant compliant
ECCN代码 - 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 - 8 ns 7.5 ns 7.5 ns 6.5 ns 11 ns 11 ns
其他特性 - FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK) - 100 MHz 117 MHz 117 MHz 133 MHz 66 MHz 66 MHz
I/O 类型 - COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 - R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100 R-PQFP-G100
JESD-609代码 - e0 e0 e0 - e0 e0
长度 - 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 - 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit
内存集成电路类型 - ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
内存宽度 - 18 18 18 18 18 18
湿度敏感等级 - 3 3 3 1 3 3
功能数量 - 1 1 1 1 1 1
端子数量 - 100 100 100 100 100 100
字数 - 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
字数代码 - 256000 256000 256000 256000 256000 256000
工作模式 - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 - 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C
组织 - 256KX18 256KX18 256KX18 256KX18 256KX18 256KX18
输出特性 - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - LQFP LQFP LQFP LQFP LQFP LQFP
封装等效代码 - QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87 QFP100,.63X.87
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
并行/串行 - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 225 NOT SPECIFIED NOT SPECIFIED
电源 - 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V 2.5/3.3,3.3 V
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大待机电流 - 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A
最小待机电流 - 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
最大压摆率 - 0.205 mA 0.22 mA 0.22 mA 0.225 mA 0.195 mA 0.195 mA
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
标称供电电压 (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 - YES YES YES YES YES YES
技术 - CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 - INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 - TIN LEAD TIN LEAD TIN LEAD - TIN LEAD TIN LEAD
端子形式 - GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 - 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
端子位置 - QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 - 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
Base Number Matches - 1 1 1 1 1 1

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