Dual-Port SRAM, 32KX8, 35ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 包装说明 | PGA, |
| Reach Compliance Code | compliant |
| 最长访问时间 | 35 ns |
| 其他特性 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN |
| JESD-30 代码 | S-CPGA-P68 |
| 长度 | 29.464 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 座面最大高度 | 5.207 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 29.464 mm |
| Base Number Matches | 1 |
| 70V07S35GG8 | 70V07S35GGI | 70V07S35GGI8 | 70V07S55GG8 | 70V07S35PFGI8 | 70V07S35PFGI | 70V07L55GG8 | 70V07S25JGI8 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 32KX8, 35ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-68 | Dual-Port SRAM | Dual-Port SRAM | Dual-Port SRAM, 32KX8, 55ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-68 | Dual-Port SRAM | Dual-Port SRAM | Dual-Port SRAM, 32KX8, 55ns, CMOS, CPGA68, 1.180 X 1.180 INCH, 0.160 INCH HEIGHT, GREEN, CERAMIC, PGA-68 | Dual-Port SRAM, 32KX8, 25ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 包装说明 | PGA, | PGA, | PGA, | PGA, | QFP, | QFP, | PGA, | QCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 最长访问时间 | 35 ns | 35 ns | 35 ns | 55 ns | 35 ns | 35 ns | 55 ns | 25 ns |
| JESD-30 代码 | S-CPGA-P68 | X-PPGA-P68 | X-PPGA-P68 | S-CPGA-P68 | X-PQFP-G80 | X-PQFP-G80 | S-CPGA-P68 | S-PQCC-N68 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 80 | 80 | 68 | 68 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | - | -40 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | PGA | PGA | PGA | PGA | QFP | QFP | PGA | QCCN |
| 封装形状 | SQUARE | UNSPECIFIED | UNSPECIFIED | SQUARE | UNSPECIFIED | UNSPECIFIED | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | GULL WING | GULL WING | PIN/PEG | NO LEAD |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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